CPDQC5V0ESPC-HF
Page 1
QW-G7096
REV:A
Comchip Technology CO., LTD.
RoHS Device
Halogen Free
Company reserves the right to improve product design , functions and reliability without notice.
Circuit diagram
Mechanical data
Features
- Bi-directional ESD protection.
- Surface mount package.
- Ultra small SMD package:0402C
- High component density.
- Low clamping voltage.
- Low leakage.
- IEC 61000-4-2 ESD protection up to ±25kV(Contact).
Maximum Rating (at TA=25°C unless otherwise noted)
Symbol
Parameter Value
Unit
Conditions
Peak pulse power
PPP W
100
Operation temperature range
Tj
°C
Storage temperature range
TSTG
-55~+150
°C
ESD
kV
IEC 61000-4-2(air)
IEC 61000-4-2(contact)
ESD capability
-40~+125
Peak pulse current
IPP A
TP = 8/20us
4
TP = 8/20us
±25
- Ultra-Low capacitance: 0.28 pF(typ.)
- Case: standard package, 0402C/SOD-923F
molded plastic.
- Mounting position: Any.
- Weight: 0.001 grams(approx.).
- Terminals: plated, solderable per Gold
MIL-STD-750, method 2026.
Symbol
Typ
Parameter
Min
Max
Unit
Conditions
Breakdown voltage
VBR V
IT = 1mA
7
Reverse leakage current
IR nA
VRWM = 5V
50
Clamping voltage
VC
V
IPP = 1A, TP = 8/20us
IPP = 4A, TP = 8/20us
V
Working peak reverse voltage
VRWM
5
Dynamic resistance
RDYN
Ω
Electrical Characteristics (at TA=25°C unless otherwise noted)
9
1.3
<1
13
20
Clamping voltage
VCL
V
IPP = 8A, TP = 100ns
IPP = 16A, TP = 100ns
25
35
Junction capacitance
CJ
pF
VR = 0V, f = 1MHz
0.35
0.28
15
25
SMD ESD Protection Diode
Dimensions in inches and (millimeter)
0402C/SOD-923F
0.022(0.55)
0.018(0.45)
0.001(0.02)
Max.
0.041(1.05)
0.037(0.95)
0.026(0.65)
BSC.
0.012(0.30)
0.008(0.20)
0.022(0.55)
0.018(0.45)
0.026(0.65)
0.022(0.55)
