IRF610S, SiHF610S, IRF610L, SiHF610L
www.vishay.com
Vishay Siliconix
S15-1659-Rev. D, 20-Jul-15
1
Document Number: 91024
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Power MOSFET
FEATURES
• Surface mount
• Available in tape and reel
• Dynamic dV/dt rating
• Repetitive avalanche rated
• Fast switching
• Ease of paralleling
• Simple drive requirements
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details.
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The D
2
PAK (TO-263) is a surface mount power package
capable of accommodating die sizes up to HEX-4. It
provides the highest power capability and the lowest
possible on-resistance in any existing surface mount
package. The D
2
PAK (TO-263) is suitable for high current
applications because of its low internal connection
resistance and can dissipate up to 2.0 W in a typical surface
mount application.
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= 50 V, starting T
J
= 25 °C, L = 8.8 mH, R
g
= 25 , I
AS
= 3.3 A (see fig. 12).
c. I
SD
3.3 A, dI/dt 70 A/μs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
PRODUCT SUMMARY
V
DS
(V) 200
R
DS(on)
()V
GS
= 10 V 1.5
Q
g
(Max.) (nC) 8.2
Q
gs
(nC) 1.8
Q
gd
(nC) 4.5
Configuration Single
N-Channel MOSFET
G
D
S
D
2
PAK (TO-263)
G
D
S
I
2
PAK (TO-262)
G
D
S
ORDERING INFORMATION
Package D
2
PAK (TO-263) D
2
PAK (TO-263) D
2
PAK (TO-263) I
2
PAK (TO-262)
Lead (Pb)-free and halogen-free SiHF610S-GE3 SiHF610STRL-GE3
a
SiHF610STRR-GE3
a
SiHF610L-GE3
a
Lead (Pb)-free IRF610SPbF IRF610STRLPbF
a
IRF610STRRPbF
a
IRF610LPbF
a
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
200
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current V
GS
at 10 V
T
C
= 25 °C
I
D
3.3
AT
C
= 100 °C 2.1
Pulsed Drain Current
a
I
DM
10
Linear Derating Factor 0.29
W/°C
Linear Derating Factor (PCB mount)
e
0.025
Single Pulse Avalanche Energy
b
E
AS
64 mJ
Repetitive Avalanche Current
a
I
AR
3.3 A
Repetitive Avalanche Energy
a
E
AR
3.6 mJ
Maximum Power Dissipation T
C
= 25 °C
P
D
36
W
Maximum Power Dissipation (PCB mount)
e
T
A
= 25 °C 3.0
Peak Diode Recovery dV/dt
c
dV/dt 5.0 V/ns
Operating Junction and Storage Temperature Range T
J
, T
stg
-55 to +150
°C
Soldering Recommendations (Peak temperature)
d
for 10 s 300