CREAT BY ART
- Glass passivated chip junction
- Ideal for automated placement
- Low forward voltage drop
- Fast switching for high efficiency
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
V
RRM
50 100 200 300 400 600 800 1000 V
V
RMS
35 70 140 210 280 420 560 700 V
V
DC
50 100 200 300 400 600 800 1000 V
I
F(AV)
A
t
rr
ns
C
J
pF
R
θJA
°C/W
T
J
°C
T
STG
°C
Document Number: DS_D1410042 Version: K15
HS1A - HS1M
Taiwan Semiconductor
1A, 50V - 1000V Hi
h Efficient Surface Mount Rectifiers
FEATURES
Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: DO-214AC (SMA)
DO-214AC (SMA)
Polarity: Indicated by cathode band
Weight: 0.06 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
HS
1M
UNIT
HS
1D
HS
1F
HS
1G
HS
1J
Maximum repetitive peak reverse voltage
Maximum RMS voltage
PARAMETER SYMBOL
HS
1A
HS
1B
Maximum DC blocking voltage
Maximum average forward rectified current 1
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
I
FSM
30 A
Maximum instantaneous forward voltage (Note 1)
@ 1 A
V
F
V
I
R
5
μA
150
Maximum reverse current @ rated V
R
Note 1: Pulse test with PW=300μs, 1% duty cycle
Maximum reverse recovery time (Note 2) 75
Typical junction capacitance (Note 3)
Typical thermal resistance 70
50
20 15
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
T
J
=25°C
T
J
=100°C
T
J
=125°C
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
HS
1K
1.0 1.3 1.7
50
