LX5553
PRODUCTION DATA SHEET
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
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.COM
2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier, LNA & SP3T Switch
TM
®
Copyright
2010
Rev. 1.0, 2010-03-18
D E S C R I P T I O N
LX5553 is a high-integration, high-
performance WLAN front-end module
(FEM) for 802.11b/g/n and other
applications in the 2.4-2.5GHz
frequency range. LX5553 integrates
an advanced InGaP/GaAs Hetero-
junction Bipolar Transistor (HBT)
power amplifier with on chip
impedance matching, a fully matched
low noise amplifier based on InGaAs
Enhancement mode pseudo-morphic
high electron mobility transistor (E-
pHEMT) technology, and a Depletion
mode pHEMT (D-pHEMT) single-
pole triple-throw (SP3T) switch, all
into a single package with 3x3mm
footprint. LX5553 provides capability
of sharing a single antenna between
WLAN and Bluetooth systems
through the SP3T switch.
The Tx path of LX5553 features a
two-stage monolithic microwave
integrated circuit (MMIC) power
amplifier with active bias circuitry,
on-chip output power detector, and
50 input/output matching inside the
package. With 3.6V supply voltage
and 82mA bias current, the Tx path
provides about 25dB power gain, and
+17dBm linear output power, with
EVM (<3%) for 64QAM/ 54Mbps
OFDM. Both gain and power are
readily measured at antenna port, with
the insertion loss of the SP3T switch
included.
The Rx path of LX5553 features
13dB small-signal gain, noise figure of
2.1dB, and high input referred third-
order harmonic intercept point (IIP3) of
+5dBm, including the SP3T switch loss.
The LNA consumes about 11mA
current with a single 3.6V supply.
The Bluetooth path of LX5553
features low insertion loss of 0.9dB and
high input referred 1dB gain
compression point (IP
1dB
) of +29dBm.
LX5553 is available in a 16-pin, low
profile of 0.55mm, 3x3mm
2
micro-lead
package (MLPQ-16L) in very low
profile of 0.55mm. With its high level
of functional integration, best-class
performance, compact footprint and low
profile, LX5553 offers an ideal front-
end solution for the ever demanding
design requirements of today’s highly
integrated mobile equipments, including
802.11b/g/n and Bluetooth applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
K E Y F E A T U R E S
2.4-2.5GHz 802.11b/g/n Front-
End Solution in a Single MLP
Package
SP3T for Sharing Antenna
between WLAN and Bluetooth
systems
All RF I/O Matched to 50
Single-Supply Voltage 3.0V to
4.2V
Small Footprint: 3x3mm
2
Low Profile: 0.55mm
RoHS Compliant & Pb-Free
TX Features :
Power Gain ~ 25 dB*
Pout ~ +17 dBm* for 3% EVM at
Antenna
Current ~145 mA at +17 dBm*
Pout ~ +21 dBm* for 11b 1Mbps
DSSS Mask Compliance
Quiescent Current ~ 82 mA
RX Features :
Gain ~ 13 dB*
Noise Figure ~ 2.1 dB*
IIP3 ~ +5 dBm*
Bluetooth Path :
Insertion Loss ~ 0.9 dB
IP1dB ~ +29 dBm
* Including SP3T switch loss
A P P L I C A T I O N S
IEEE 802.11b/g/n
Mobile Phone WLAN module
B L O C K D I A G R A M
L
L
X
X
5
5
5
5
5
5
3
3
*IMN:
Input Matching Network
*OMN:
Output Matching Network
Vref
TxIn
Antenna
Port
Vc1
Det
CtrlTx / CtrlRx / CtrlBT
Vdd
LNAOut
OMN*
IMN*
PA
PAOut/
Vc2
SwIn
BT
LNA
*IMN:
Input Matching Network
*OMN:
Output Matching Network
Vref
TxIn
Antenna
Port
Vc1
Det
CtrlTx / CtrlRx / CtrlBT
Vdd
LNAOut
OMN*
IMN*
PA
PAOut/
Vc2
SwIn
BT
LNA
