LTM8046
18
8046fb
For more information www.linear.com/LTM8046
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
Y
X
aaa Z
aaa Z
DETAIL A
PACKAGE BOTTOM VIEW
3
SEE NOTES
L
K
J
H
G
F
E
D
C
B
A
1234567
PIN 1
BGA Package
51-Lead (15.00mm × 9.00mm × 4.92mm)
(Reference LTC DWG# 05-08-1889 Rev Ø)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
Øb (51 PLACES)
DETAIL B
SUBSTRATE
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.71
0.60
0.27
3.95
NOM
4.92
0.60
4.32
0.78
0.63
15.00
9.00
1.27
12.70
7.62
0.32
4.00
MAX
5.12
0.70
4.42
0.85
0.66
0.37
4.05
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 51
A2
D
E
e
b
F
G
SUGGESTED PCB LAYOUT
TOP VIEW
0.000
3.810
5.080
3.810
6.350
5.080
6.350
2.540
1.270
3.810
2.540
1.270
3.810
2.540
1.270
0.3175
0.3175
0.000
// bbb Z
Z
H2
H1
0.630 ±0.025 Ø 51x
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
LTMXXXXXX
µModule
