- 20 -
I
II
I
PACKAGE OUTLINE (HFFP10-CD)
This product contains Gallium-Arsenide (GaAs) which is a harmful material.
• Do NOT eat or put into mouth.
• Do NOT dispose in fire or break up this product.
• Do NOT chemically make gas or powder with this product.
• To waste this product, please obey the relating law of your country.
with electric static discharge
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions.
The application circuits in this databook are
described only to show representative usages of
the product and not intended for the guarantee or
permission of any right including the industrial
rights.
This product is hollow seal package type, and it is with the structure susceptible to stress from the outside. Therefore, note the following in
relation to the contents, after conducting an evaluation, please use.
1. After mounting this product, to implement the potting and transfer molding, please the confirmation of resistance to temperature changes
and shrinkage stress involved in the molding.
2. When mounted on the product, collet diameter please use more than 1mmφ. In addition, the value of static load is recommended mounting
less than 5N.
3. For dynamic load at the time of mounting, please use it after confirming in consideration of the contact area / speed / load.
Package Size :2.5±0.1mm
0.63mm max.
Electrode Dimensions clearance
: ±0.05mm
Unit : mm
Substrate : Ceramic
Terminal treat : Au
Lid : SnAg/Kovar/Ni
Weight (typ.) : 18.00mg
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Exposed PAD
Ground connection is required.
