IRG4BC20SD-SPBF

IRG4BC20SD-SPbF
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
Features
E
G
n-channel
C
V
CES
= 600V
V
CE(on) typ.
= 1.4V
@V
GE
= 15V, I
C
= 10A
Standard Speed IGBT
01/21/10
Benefits
Parameter Max. Units
V
CES
Collector-to-Emitter Voltage 600 V
I
C
@ T
C
= 25°C Continuous Collector Current 19
I
C
@ T
C
= 100°C Continuous Collector Current 10
I
CM
Pulsed Collector Current 38 A
I
LM
Clamped Inductive Load Current 38
I
F
@ T
C
= 100°C Diode Continuous Forward Current 7.0
I
FM
Diode Maximum Forward Current 38
V
GE
Gate-to-Emitter Voltage ± 20 V
P
D
@ T
C
= 25°C Maximum Power Dissipation 60
P
D
@ T
C
= 100°C Maximum Power Dissipation 24
T
J
Operating Junction and -55 to +150
T
STG
Storage Temperature Range °C
Parameter Typ. Max. Units
R
θJC
Junction-to-Case - IGBT ––– 2.1
R
θJC
Junction-to-Case - Diode ––– 3.5 °C/W
R
θJA
Junction-to-Ambient ( PCB Mounted,steady-state)* ––– 80
Wt Weight 1.44 ––– g (oz)
Thermal Resistance
Absolute Maximum Ratings
W
* When mounted on 1" square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering techniques
refer to application note #AN-994.
www.irf.com 1
• Extremely low voltage drop 1.4Vtyp. @ 10A
• S-Series: Minimizes power dissipation at up to 3
KHz PWM frequency in inverter drives, up to 4
KHz in brushless DC drives.
• Very Tight Vce(on) distribution
• IGBT co-packaged with HEXFRED
TM
ultrafast,
ultra-soft-recovery anti-parallel diodes for use
in bridge configurations
• Industry standard D
2
Pak package
• Lead-Free
• Generation 4 IGBT's offer highest efficiencies
available
• IGBT's optimized for specific application conditions
HEXFRED diodes optimized for performance with
IGBT's . Minimized recovery characteristics require
less/no snubbing
• Lower losses than MOSFET's conduction and
Diode losses
D
2
Pak
PD -95691A
IRG4BC20SD-SPbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
Q
g
Total Gate Charge (turn-on) 27 40 I
C
= 10A
Qge Gate - Emitter Charge (turn-on) 4.3 6.5 nC V
CC
= 400V See Fig. 8
Q
gc
Gate - Collector Charge (turn-on) 10 15 V
GE
= 15V
t
d(on)
Turn-On Delay Time 62 T
J
= 25°C
t
r
Rise Time 32 ns I
C
= 10A, V
CC
= 480V
t
d(off)
Turn-Off Delay Time 690 1040 V
GE
= 15V, R
G
= 50
t
f
Fall Time 480 730 Energy losses include "tail" and
E
on
Turn-On Switching Loss 0.32 diode reverse recovery.
E
off
Turn-Off Switching Loss 2.58 mJ See Fig. 9, 10, 11,18
E
ts
Total Switching Loss 2.90 4.5
t
d(on)
Turn-On Delay Time 64 T
J
= 150°C, See Fig. 10,11, 18
t
r
Rise Time 35 ns I
C
= 10A, V
CC
= 480V
t
d(off)
Turn-Off Delay Time 980 V
GE
= 15V, R
G
= 50
t
f
Fall Time 800 Energy losses include "tail" and
E
ts
Total Switching Loss 4.33 mJ diode reverse recovery.
L
E
Internal Emitter Inductance 7.5 nH Measured 5mm from package
C
ies
Input Capacitance 550 V
GE
= 0V
C
oes
Output Capacitance 39 pF V
CC
= 30V See Fig. 7
C
res
Reverse Transfer Capacitance 7.1 ƒ = 1.0MHz
t
rr
Diode Reverse Recovery Time 37 55 ns T
J
= 25°C See Fig.
—5590 T
J
= 125°C 14 I
F
= 8.0A
I
rr
Diode Peak Reverse Recovery Current 3.5 5.0 A T
J
= 25°C See Fig.
4.5 8.0 T
J
= 125°C 15 V
R
= 200V
Q
rr
Diode Reverse Recovery Charge 65 138 nC T
J
= 25°C See Fig.
124 360 T
J
= 125°C 16 di/dt = 200Aµs
di
(rec)M
/dt Diode Peak Rate of Fall of Recovery 240 A/µs T
J
= 25°C See Fig.
During t
b
210 T
J
= 125°C 17
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
Collector-to-Emitter Breakdown Voltageƒ 600 V V
GE
= 0V, I
C
= 250µA
V
(BR)CES
/T
J
Temperature Coeff. of Breakdown Voltage 0.75 V/°C V
GE
= 0V, I
C
= 1.0mA
V
CE(on)
Collector-to-Emitter Saturation Voltage 1.40 1.6 I
C
= 10A V
GE
= 15V
1.85 V I
C
= 19A See Fig. 2, 5
1.44 I
C
= 10A, T
J
= 150°C
V
GE(th)
Gate Threshold Voltage 3.0 6.0 V
CE
= V
GE
, I
C
= 250µA
V
GE(th)
/T
J
Temperature Coeff. of Threshold Voltage -11 mV/°C V
CE
= V
GE
, I
C
= 250µA
g
fe
Forward Transconductance 2.0 5.8 S V
CE
= 100V, I
C
= 10A
I
CES
Zero Gate Voltage Collector Current 250 µA V
GE
= 0V, V
CE
= 600V
1700 V
GE
= 0V, V
CE
= 600V, T
J
= 150°C
V
FM
Diode Forward Voltage Drop 1.4 1.7 V I
C
= 8.0A See Fig. 13
1.3 1.6 I
C
= 8.0A, T
J
= 150°C
I
GES
Gate-to-Emitter Leakage Current ±100 nA V
GE
= ±20V
Switching Characteristics @ T
J
= 25°C (unless otherwise specified)
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
IRG4BC20SD-SPbF
www.irf.com 3
0.1 1 10 100
0.0
1.0
2.0
3.0
f, Frequency (KHz)
LOAD CURRENT (A)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I
RMS
of fundamental)
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
60% of rated
voltage
I
Ideal diodes
Square wave:
For both:
Duty cycle: 50%
T = 125°C
T = 90°C
Gate drive as specified
sink
J
Power Dissipation = W
1.7
1
10
100
5 6 7 8 9 10 11 12
V , Gate-to-Emitter Voltage (V)
I , Collector-to-Emitter Current (A)
GE
C
V = 50V
s PULSE WIDTH
CC
T = 25 C
J
o
T = 150 C
J
o
1
10
100
0.0 1.0 2.0 3.0 4.0
V , Collector-to-Emitter Voltage (V)
I , Collector Current (A)
CE
C
V = 15V
20µs PULSE WIDTH
GE
T = 25 C
J
°
T = 150 C
J
°

IRG4BC20SD-SPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
IGBT 600V 19A 60W D2PAK
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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