NCV8535
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4
PIN FUNCTION DESCRIPTION
Pin No. Pin Name Description
FIXED VERSION
1, 2
V
out
Regulated output voltage. Bypass to ground with C
out
w 1.0 mF.
3 SENSE For output voltage sensing, connect to Pins 1 and 2.
4 GND Power Supply Ground
7 NR Noise Reduction Pin. This is an optional pin used to further reduce noise.
8 SD Shutdown pin. When not in use, this pin should be connected to the input pin.
9, 10 V
in
Power Supply Input Voltage
5, 6 NC Not Connected
EPAD EPAD Exposed thermal pad should be connected to ground.
ADJUSTABLE VERSION
1, 2
V
out
Regulated output voltage. Bypass to ground with C
out
w 1.0 mF.
3 Adj Adjustable pin; reference voltage = 1.25 V.
4 GND Power Supply Ground
7 NR Noise Reduction Pin. This is an optional pin used to further reduce noise.
8 SD Shutdown pin. When not in use, this pin should be connected to the input pin.
9, 10 V
in
Power Supply Input Voltage
5, 6 NC Not Connected
EPAD EPAD Exposed thermal pad should be connected to ground.
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage V
in
−0.3 to +16 V
Output Voltage V
out
−0.3 to V
in
+0.3 or 10 V* V
Shutdown Pin Voltage V
sh
−0.3 to +16 V
Junction Temperature Range T
J
−40 to +150 °C
Storage Temperature Range T
stg
−55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
NOTE: This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) tested per AEC−Q100−002 (EIA/JESD22−A114)
Machine Model (MM) tested per AEC−Q100−003 (EIA/JESD22−A115)
Charged Device Model (CDM) tested per EIA/JESD22−C101
*Which ever is less. Reverse bias protection feature valid only if V
out
− V
in
≤ 7 V.
THERMAL CHARACTERISTICS
Characteristic
Test Conditions (Typical Value)
Unit
Min Pad Board (Note 1) 1, Pad Board (Note 1)
Junction−to−Air, qJA
215 66 °C/W
Junction−to−Pin, yJL2
55 17 °C/W
1. As mounted on a 35 x 35 x 1.5 mm FR4 Substrate, with a single layer of a specified copper area of 2 oz (0.07 mm thick) copper traces and
heat spreading area. JEDEC 51 specifications for a low and high conductivity test board recommend a 2 oz copper thickness. Test conditions
are under natural convection or zero air flow.