S70GL02GP12FAIR20

May 19, 2008 S70GL-P_00_02 S70GL-P MirrorBit
®
Flash 7
Data Sheet
1. Ordering Information
The ordering part number is formed by a valid combination of the following:
1.1 Recommended Combinations
Recommended Combinations table below list various configurations planned to be available in volume. The
table below will be updated as new combinations are released. Check with your local sales representative to
confirm availability of specific configuration not listed or to check on newly released combinations.
Notes
1. Contact a local sales representative for availability.
2. BGA package marking omits leading “S29” and packing type designator from ordering part number.
3. Packing Type “0” is standard option.
S70GL02GP 11 F F C R1 0
PACKING TYPE
0 = Tray (standard; see (Note 3)
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER (V
IO
range, protection when WP# =V
IL
)
01 = V
IO
= V
CC
= 2.7 to 3.6 V, highest address sector protected
02 = V
IO
= V
CC
= 2.7 to 3.6 V, lowest address sector protected
V1 = V
IO
= 1.65 to V
CC
, V
CC
= 2.7 to 3.6 V, highest address sector protected
V2 = V
IO
= 1.65 to V
CC
, V
CC
= 2.7 to 3.6 V, lowest address sector protected
R1 = V
IO
= V
CC
= 3.0 to 3.6 V, highest address sector protected
R2 = V
IO
= V
CC
= 3.0 to 3.6 V, lowest address sector protected
TEMPERATURE RANGE
I = Industrial (–40°C to +85°C)
C = Commercial (0°C to +85°C)
PACKAGE MATERIALS SET
A= Pb (Note 1)
F = Pb-free
PACKAGE TYPE
F = Fortified Ball Grid Array, 1.0 mm pitch package
SPEED OPTION
11 = 110 ns
12 = 120 ns
13 = 130 ns
DEVICE NUMBER/DESCRIPTION
S70GL02GP
3.0 Volt-only, 2048 Megabit (128 M x 16-Bit/256 M x 8-Bit) Page-Mode Flash Memory
Manufactured on 90 nm MirrorBit process technology
S29GL-P Recommended Combinations (Note 1)
Base OPN Speed (ns)
Package &
Temperature
Model Number Packing Type
Ordering Part Number
(x = Packing Type)
S70GL02GP 110
FFC, FAC
(Note 2)
R1, R2
0, 2, 3
(Note 3)
S70GL02GP11FFCR1x
S70GL02GP11FFCR2x
S70GL02GP11FACR1x
S70GL02GP11FACR2x
8 S70GL-P MirrorBit
®
Flash S70GL-P_00_02 May 19, 2008
Data Sheet
2. Input/Output Descriptions & Logic Symbol
Table 2.1 identifies the input and output package connections provided on the device.
Table 2.1 Input/Output Descriptions
Symbol Type Description
A26–A0 Input Address lines for GL02GP
DQ14–DQ0 I/O Data input/output.
DQ15/A-1 I/O
DQ15: Data input/output in word mode.
A-1: LSB address input in byte mode.
CE# Input Chip Enable.
OE# Input Output Enable.
WE# Input Write Enable.
V
CC
Supply Device Power Supply.
V
IO
Supply Versatile IO Input.
V
SS
Supply Ground.
RY/BY# Output
Ready/Busy. Indicates whether an Embedded Algorithm is in progress or complete. At
V
IL
, the device is actively erasing or programming. At High Z, the device is in ready.
BYTE# Input
Selects data bus width. At V
IL
, the device is in byte configuration and data I/O pins DQ0-
DQ7 are active. At V
IH
, the device is in word configuration and data I/O pins DQ0-DQ15
are active.
RESET# Input Hardware Reset. Low = device resets and returns to reading array data.
WP#/ACC Input
Write Protect/Acceleration Input. At V
IL
, disables program and erase functions in the
outermost sectors. At V
HH
, accelerates programming; automatically places device in
unlock bypass mode. Should be at V
IH
for all other conditions.
RFU Reserved Reserved for future use. Not connected internally.
May 19, 2008 S70GL-P_00_02 S70GL-P MirrorBit
®
Flash 9
Data Sheet
2.1 Special Handling Instructions for BGA Package
Special handling is required for Flash Memory products in BGA packages.
Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
Figure 2.1 64-ball Fortified Ball Grid Array
64-ball Fortified BGA
Top View, Balls Facing Down
A2 C2 D2 E2 F2 G2 H2
A3 C3 D3 E3 F3 G3 H3
A4 C4 D4 E4 F4 G4 H4
A5 C5 D5 E5 F5 G5 H5
A6 C6 D6 E6 F6 G6 H6
A7 C7 D7 E7 F7 G7 H7
DQ15/A-1
V
SS
BYTE#A16A15A14A12A13
DQ13 DQ6DQ14DQ7A11A10A8A9
V
CC
DQ4DQ12DQ5A19A21RESET#WE#
DQ11 DQ3DQ10DQ2A20A18WP#/ACCRY/BY#
DQ9 DQ1DQ8DQ0A5A6A17A7
OE#
V
SS
CE#A0A1A2A4A3
A1 C1 D1 E1 F1 G1 H1
RFU RFUV
IO
RFURFURFUA26RFU
A8 C8
B2
B3
B4
B5
B6
B7
B1
B8 D8 E8 F8 G8 H8
A25
RFU
A24V
SS
V
IO
A23A22RFU

S70GL02GP12FAIR20

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC FLASH 2G PARALLEL 64FBGA GL-P
Lifecycle:
New from this manufacturer.
Delivery:
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