EVERLIGHT ELECTRONICS CO.,LTD.
Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 1 Page: 8 of 9
Device No：DMO-0000008 Prepared date：09 -26-2007 Prepared by：IBU_NPID2
IRM-H6XXT/TR2
Reliability Test Item And Condition
The reliability of products shall be satisfied with items listed below.
Confidence level：90%
LTPD：10%
Reflow Terms: JEDEC Level 4 Specification
Drying; Temp.:125℃ 24hrs Æ Moisture 30℃ / 60% RH 96hrs Æ Reflow Temp.: 260℃±5℃
10sec, 3 times
Note:
1. Not sooner than 15 minutes and not longer than 4 hours after removal from the
temperature/humidity chamber.
2. The time between reflow shall be 5 minutes minimum and 60 minutes maximum.
Recommended method of storage
Dry box storage is recommended as soon as the aluminum bag has been opened prevent
moisture absorption. The following conditions should be observed, if dry boxes are not available:
z Storage temperature 10℃ to 30℃
z Storage humidity ≦60%RH max.
After more than 72 hours under these conditions moisture content will be too high for
Reflow soldering:
In case of moisture absorption, the devices will recover to former condition by drying
under the following condition:
192 hours at 40℃+5℃/-0℃ and 5%RH (dry air / nitrogen) or
96 hours at 60℃+5℃ and < 5%RH for all device containers or
24 hours at 125℃+5℃ not suitable for reel or tubes.
ESD Precaution
Proper storage and handing procedures should be followed to prevent ESD damage to
the devices especially when they are removed from the Anti-static bag. Electro-Static Sensitive
Devices warning labels are on the packing.
