MC74LVXC3245DWRG

MC74LVXC3245
http://onsemi.com
7
WAVEFORM 1 - PROPAGATION DELAYS
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
V
CC
0 V
V
OH
V
OL
An, Bn
Bn, An
t
PHL
t
PLH
WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
V
CC
0 V
0 V
OE
, T/R
An, Bn
t
PZH
V
CC
t
PHZ
t
PZL
t
PLZ
An, Bn
50% V
CC
50% V
CC
50% V
CC
50% V
CC
50% V
CC
50% V
CC
Figure 4. AC Waveforms
50% V
CC
V
CC
V
OH
- 0.3 V
V
OL
+ 0.3 V
GND
50% V
CC
OPEN
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
R
1
C
L
2xV
CC
TEST SWITCH
t
PLH
, t
PHL
, t
PZH
, t
PHZ
Open
t
PZL
, t
PLZ
2xV
CC
C
L
= 50 pF or equivalent (Includes jig and probe capacitance)
R
L
= R
1
= 500 W or equivalent
R
T
= Z
OUT
of pulse generator (typically 50 W)
Figure 5. Test Circuit
MC74LVXC3245
http://onsemi.com
8
PACKAGE DIMENSIONS
SOIC24
DW SUFFIX
CASE 751E04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
A
B
P
12X
D24X
12
1324
1
M
0.010 (0.25) B
M
S
A
M
0.010 (0.25) B
S
T
T
G
22X
SEATING
PLANE
K
C
R
X 45
_
M
F
J
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 15.25 15.54 0.601 0.612
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G 1.27 BSC 0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M 0 8 0 8
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
____
MC74LVXC3245
http://onsemi.com
9
PACKAGE DIMENSIONS
TSSOP24
DT SUFFIX
CASE 948H01
ISSUE A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 7.70 7.90 0.303 0.311
B 4.30 4.50 0.169 0.177
C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE -W-.
___ _
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
U
SEATING
PLANE
0.10 (0.004)
T
SECTION NN
DETAIL E
J
J1
K
K1
DETAIL E
F
M
W
0.25 (0.010)
13
24
12
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
V
24X REFK
N
N
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MC74LVXC3245/D
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MC74LVXC3245DWRG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Bus Transceivers Dual Supply Octal Transceiver
Lifecycle:
New from this manufacturer.
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