IRG8CH20K10F

IRG8CH20K10F
1
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V
CES
= 1200V
I
C(Nominal)
= 15A
T
J(max)
= 175°C
V
CE(on)
typ
= 1.7V @ I
C
= 15A
Applications
Industrial Motor Drives
UPS
HEV Inverter
Welding
E
C
G
n-channel
Base part number Package Type
Standard Pack
Form Quantity
IRG8CH20K10F Die on Film Wafer 1 IRG8CH20K10F
Orderable part number
Mechanical Parameter
Die Size 4.7 x 4.3 mm
2
Minimum Street Width 95 µm
Emitter Pad Size See Die Drawing
mm
2
Gate Pad Size 1.0 x 0.6
Area Total / Active 20 /10
Thickness 140 µm
Wafer Size 200 mm
Notch Position 0 Degrees
Maximum-Possible Chips per Wafer 1366 pcs.
Passivation Front side Silicon Nitride, Polyimide
Front Metal Al, Si (5.6µm)
Backside Metal AI, Ti, Ni, Ag
Die Bond Electrically conductive epoxy or solder
Reject Ink Dot Size 0.25 mm diameter minimum
G C E
Gate Collector Emitter
INSULATED GATE BIPOLAR TRANSISTOR
Features Benefits
Low V
CE(on)
Trench IGBT Technology High Efficiency in a Wide Range of Applications
Low Switching Losses Suitable for a Wide Range of Switching Frequencies
Very Soft Turn-off Characteristics
Reduced EMI and Overvoltage in Motor Drive Applications
10µs Short Circuit SOA
Rugged Transient Performance for Increased Reliability
Square RBSOA
Tight Parameter Distribution
Excellent Current Sharing in Parallel Operation
Positive V
CE(on)
Temperature Coefficient
T
j(max)
= 175°C
Increased Reliability
IRG8CH20K10F
2
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Static Characteristics (Tested on wafers) @ T
J
=25°C
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
Collector-to-Emitter Breakdown Voltage 1200 ––– –––
V
V
GE
= 0V, I
C
= 250µA
V
CE(sat)
Collector-to-Emitter Saturated Voltage ––– ––– 2.0 V
GE
= 15V, I
C
= 15A, T
J
= 25°C
V
GE(th)
Gate-Emitter Threshold Voltage 5.0 ––– 6.5 I
C
= 600µA , V
GE
= V
CE
I
CES
Zero Gate Voltage Collector Current ––– 1.0 25 µA V
CE
= 1200V, V
GE
= 0V
I
GES
Gate Emitter Leakage Current ––– ––– ± 100 nA V
CE
= 0V, V
GE
= ±30V
Electrical Characteristics (Not subject to production test- Verified by design/characterization)
Parameter Min. Typ. Max. Units Conditions
V
CE(sat)
Collector-to-Emitter Saturated Voltage ––– 1.7 ––– V
GE
= 15V, I
C
= 15A , T
J
= 25°C 
––– 2.1 ––– V
GE
= 15V, I
C
= 15A , T
J
= 175°C
SCSOA Short Circuit Safe Operating Area 10 ––– ––– µs V
GE
= 15V, V
CC
= 600V
V
P
1200V,T
J
= 150°C
RBSOA Reverse Bias Safe Operating Area
FULL SQUARE
T
J
= 175°C, I
C
= 45A

V
CC
= 960V, Vp 1200V
V
GE
= +20V to 0V
C
iss
Input Capacitance ––– 1800 –––
pF
V
GE
= 0V
C
oss
Output Capacitance ––– 90 –––
V
CE
= 30V
C
rss
Reverse Transfer Capacitance ––– 45 –––
ƒ = 1.0MHz
Q
g
Total Gate Charge (turn-on) 90
nC
I
C
= 15A
Q
ge
Gate-to-Emitter Charge (turn-on) 5.0
V
GE
= 15V
Q
gc
Gate-to-Collector Charge (turn-on) 60
V
CC
= 600V
Switching Characteristics (Inductive Load-Not subject to production test-Verified by design/characterization)
Parameter Min. Typ. Max. Units Conditions 
t
d(on)
Turn-On delay time 20
ns
I
C
= 15A, V
CC
= 600V
t
r
Rise time 20
R
G
= 10, V
GE
=15V
t
d(off)
Turn-Off delay time 170
T
J
= 25°C
t
f
Fall time 190
t
d(on)
Turn-On delay time 20 I
C
= 15A, V
CC
= 600V
t
r
Rise time 20
R
G
= 10, V
GE
=15V
t
d(off)
Turn-Off delay time 260
T
J
= 150°C
t
f
Fall time 325
V
Notes:
The current in the application is limited by T
JMax
and the thermal properties of the assembly.
V
CC
= 80% (V
CES
), V
GE
= 20V.
Refer to AN-1086 for guidelines for measuring V
(BR)CES
safely.
Actual test limits take into account additional losses in the measurement setup.
Pulse width 400µs; duty cycle 2%.
Values influenced by parasitic L and C in measurement.
Parameter Max. Units
V
CE
Collector-Emitter Voltage, T
J
=25°C 1200 V
I
C
DC Collector Current

A
I
LM
Clamped Inductive Load Current  45 A
V
GE
Gate Emitter Voltage ± 30 V
T
J
, T
STG
Operating Junction and Storage Temperature -40 to +175 °C
Maximum Ratings
IRG8CH20K10F
3
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Submit Datasheet Feedback June 3, 2015
Die Drawing
4. DIE THICKNESS = 140 MICRO-METER
3. DIE WIDTH AND LENGTH TOLERANCE: -5m
2. CONTROLLING DIMENSION: MICRO-METER
1. ALL DIMENSIONS ARE SHOWN IN MICRO-METER
NOTES:

IRG8CH20K10F

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
IGBT 1200V ULTRA FAST DIE
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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