BSR56_57_58 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 25 June 2014 3 of 10
NXP Semiconductors
BSR56; BSR57; BSR58
N-channel FETs
5. Limiting values
[1] Mounted on a ceramic substrate, 8 mm 10 mm 0.7 mm.
6. Thermal characteristics
[1] Mounted on a ceramic substrate, 8 mm 10 mm 0.7 mm.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage - 40 V
V
GS
gate-source voltage - 40 V
V
DG
drain-gate voltage - 40 V
I
G
gate current - 50 mA
P
tot
total power dissipation T
amb
= 40 C
[1]
-250mW
T
stg
storage temperature 65 +150 C
T
j
junction temperature - 150 C
Fig 1. Power derating curve
0
T
amb
(°C)
P
tot
(mW)
300
200
100
0
40 20080 120 160
aaa-013766
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-a)
thermal resistance from junction to
ambient
[1]
430 K/W