5
Intensity Bin Limit (mcd)
Blue
Iv Bin Category Min Max
L 3.401 5.400
M 5.401 8.600
N 8.601 13.700
Tolerance +/-15%
Note:
1. Bin categories are established for classication of products. Products
may not be available in all categories. Please contact your Avago
representative for information on currently available bins.
SMT Soldering Prole
Pb free reow soldering Prole
Recommended soldering pattern (unit: mm)
250°C
TIME
TEMPERATURE
6°C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
3
°C/SEC. MAX.
3
°C/SEC. MAX.
10 - 30 SEC.
150
°C
200
°C
217
°C
(Acc. to J-STD-020C)
3
1.27 x 5 = 6.35
7.8
0.8
Recommended stencil window opening is 80%
Notes:
1. The peak temperature refers to the peak package body temperature.
2. Number of reow process shall be limited to maximum 2 times only.
Cooling process to normal temperature is required between rst and
second soldering process.