SSM2315
Rev. A | Page 12 of 16
THEORY OF OPERATION
OVERVIEW
The SSM2315 mono Class-D audio amplifier features a filterless
modulation scheme that greatly reduces the external component
count, conserving board space and, thus, reducing systems cost.
The SSM2315 does not require an output filter but, instead, relies
on the inherent inductance of the speaker coil and the natural
filtering of the speaker and human ear to fully recover the audio
component of the square wave output. Most Class-D amplifiers
use some variation of pulse-width modulation (PWM), but the
SSM2315 uses a Σ-Δ modulation to determine the switching
pattern of the output devices, resulting in a number of important
benefits. Σ-Δ modulators do not produce a sharp peak with many
harmonics in the AM frequency band, as pulse-width modulators
often do. Σ-Δ modulation provides the benefits of reducing the
amplitude of spectral components at high frequencies, that is,
reducing EMI emission that may otherwise be radiated by
speakers and long cable traces. The SSM2315 does not require
external EMI filtering for twisted speaker cable lengths shorter
than 10 cm. Due to the inherent spread spectrum nature of Σ-Δ
modulation, the need for oscillator synchronization is eliminated
for designs incorporating multiple SSM2315 amplifiers.
The SSM2315 also offers protection circuits for overcurrent and
temperature protection.
GAIN
The SSM2315 has a default gain of 6 dB that can be reduced by
using a pair of external resistors with a value calculated as follows:
External Gain Settings = 160 kΩ/(80 kΩ + R
EXT
)
POP-AND-CLICK SUPPRESSION
Voltage transients at the output of audio amplifiers may occur
when shutdown is activated or deactivated. Voltage transients as
low as 10 mV can be heard as an audio pop in the speaker. Clicks
and pops can also be classified as undesirable audible transients
generated by the amplifier system and, therefore, as not coming
from the system input signal. Such transients may be generated
when the amplifier system changes its operating mode. For example,
the following may be sources of audible transients: system power-up
and power-down, mute and unmute, input source change, and
sample rate change. The SSM2315 has a pop-and-click suppression
architecture that reduces these output transients, resulting in
noiseless activation and deactivation.
OUTPUT MODULATION DESCRIPTION
The SSM2315 uses three-level, Σ-Δ output modulation. Each
output can swing from GND to VDD and vice versa. Ideally,
when no input signal is present, the output differential voltage
is 0 V because there is no need to generate a pulse. In a real world
situation, there are always noise sources present.
Due to this constant presence of noise, a differential pulse is
generated, when required, in response to this stimulus. A small
amount of current flows into the inductive load when the differen-
tial pulse is generated.
However, most of the time, output differential voltage is 0 V,
due to the Analog Devices patented, three-level, Σ-Δ output
modulation. This feature ensures that the current flowing through
the inductive load is small.
When the user wants to send an input signal, an output pulse
is generated to follow the input voltage. The differential pulse
density is increased by raising the input signal level. Figure 33
depicts three-level, Σ-Δ output modulation with and without
input stimulus.
OUTPUT > 0V
+5V
0V
OUT+
+5V
0V
OUT–
+5V
0V
VOUT
OUTPUT < 0V
+5V
0V
OUT+
+5V
0V
OUT–
0V
–5V
VOUT
OUTPUT = 0V
OUT+
+5V
0V
+5V
0V
OUT–
+5V
–5V
0V
VOUT
06857-033
Figure 33. Three-Level, Σ-Δ Output Modulation With and Without Input Stimulus
SSM2315
Rev. A | Page 13 of 16
LAYOUT
As output power continues to increase, care must be taken to lay
out PCB traces and wires properly among the amplifier, load,
and power supply. A good practice is to use short, wide PCB
tracks to decrease voltage drops and to minimize inductance.
Ensure that track widths are at least 200 mil for every inch of track
length for lowest DCR, and use 1 oz or 2 oz of copper PCB traces
to further reduce IR drops and inductance. A poor layout increases
voltage drops, consequently affecting efficiency. Use large traces
for the power supply inputs and amplifier outputs to minimize
losses due to parasitic trace resistance.
Proper grounding guidelines help improve audio performance,
minimize crosstalk between channels, and prevent switching noise
from coupling into the audio signal. To maintain high output swing
and high peak output power, the PCB traces that connect the
output pins to the load and supply pins should be as wide as
possible to maintain the minimum trace resistances. It is also
recommended that a large ground plane be used for minimum
impedances.
In addition, good PCB layouts isolate critical analog paths from
sources of high interference. High frequency circuits (analog
and digital) should be separated from low frequency circuits.
Properly designed multilayer printed circuit boards can reduce
EMI emission and increase immunity to the RF field by a factor
of 10 or more, compared with double-sided boards. A multilayer
board allows a complete layer to be used for the ground plane,
whereas the ground plane side of a double-sided board is often
disrupted with signal crossover.
If the system has separate analog and digital ground and power
planes, the analog ground plane should be underneath the analog
power plane. Similarly, the digital ground plane should be
underneath the digital power plane. There should be no overlap
between analog and digital ground planes or analog and digital
power planes.
INPUT CAPACITOR SELECTION
The SSM2315 does not require input coupling capacitors if the
input signal is biased from 1.0 V to V
DD
− 1.0 V. Input capacitors are
required if the input signal is not biased within this recommended
input dc common-mode voltage range, if high-pass filtering is
needed, or if a single-ended source is used. If high-pass filtering
is needed at the input, the input capacitor and the input resistor
of the SSM2315 form a high-pass filter whose corner frequency
is determined by the following equation:
f
C
= 1/(2π × R
IN
× C
IN
)
The input capacitor can significantly affect the performance of
the circuit. Not using input capacitors degrades both the output
offset of the amplifier and the dc PSRR performance.
PROPER POWER SUPPLY DECOUPLING
To ensure high efficiency, low total harmonic distortion (THD),
and high PSRR, proper power supply decoupling is necessary.
Noise transients on the power supply lines are short-duration
voltage spikes. Although the actual switching frequency can range
from 10 kHz to 100 kHz, these spikes can contain frequency
components that extend into the hundreds of megahertz. The
power supply input needs to be decoupled with a good quality,
low ESL, low ESR capacitor, usually of around 4.7 μF. This capacitor
bypasses low frequency noises to the ground plane. For high
frequency transients noises, use a 0.1 μF capacitor as close as
possible to the VDD pin of the device. Placing the decoupling
capacitor as close as possible to the SSM2315 helps maintain
efficient performance.
SSM2315
Rev. A | Page 14 of 16
OUTLINE DIMENSIONS
101507-C
1.490
1.460 SQ
1.430
0.350
0.320
0.290
0.655
0.600
0.545
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
123
B
C
0.270
0.240
0.210
0.385
0.360
0.335
A1 BALL
CORNER
SEATING
PLANE
0.50
BALL PITCH
Figure 34. 9-Ball Wafer Level Chip Scale Package [WLCSP]
(CP-9-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
SSM2315CBZ-R2
1
−40°C to +85°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-2 Y0P
SSM2315CBZ-REEL
1
−40°C to +85°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-2 Y0P
SSM2315CBZ-REEL7
1
−40°C to +85°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-2 Y0P
SSM2315-EVALZ
1
Evaluation Board
1
Z = RoHS Compliant Part.

SSM2315CBZ-REEL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Audio Amplifiers Filterless Hi Eff Mono 3W Class-D
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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