© Semiconductor Components Industries, LLC, 2008
September, 2008 − Rev. 7
1 Publication Order Number:
MJF122/D
MJF122, MJF127
Complementary Power
Darlingtons
For Isolated Package Applications
Designed for general−purpose amplifiers and switching
applications, where the mounting surface of the device is required to
be electrically isolated from the heatsink or chassis.
Features
• Electrically Similar to the Popular TIP122 and TIP127
• 100 V
CEO(sus)
• 5.0 A Rated Collector Current
• No Isolating Washers Required
• Reduced System Cost
• High DC Current Gain − 2000 (Min) @ I
C
= 3 Adc
• UL Recognized, File #E69369, to 3500 V
RMS
Isolation
• Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−Emitter Voltage V
CEO
100 Vdc
Collector−Base Voltage V
CB
100 Vdc
Emitter−Base Voltage V
EB
5 Vdc
RMS Isolation Voltage (Note 1)
(t = 0.3 sec, R.H. ≤ 30%, T
A
= 25°C)
Per Figure 14
V
ISOL
4500 V
RMS
Collector Current − Continuous
Peak
I
C
5
8
Adc
Base Current I
B
0.12 Adc
Total Power Dissipation (Note 2)
@ T
C
= 25_C
Derate above 25_C
P
D
30
0.24
W
W/_C
Total Power Dissipation @ T
A
= 25_C
Derate above 25_C
P
D
2
0.016
W
W/_C
Operating and Storage Junction Temperat-
ure Range
T
J
, T
stg
−65 to
+ 150
I
C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient
R
q
JA
62.5
_C/W
Thermal Resistance, Junction−to−Case
(Note 2)
R
q
JC
4.1
_C/W
Lead Temperature for Soldering Purpose T
L
260
_C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Proper strike and creepage distance must be provided.
2. Measurement made with thermocouple contacting the bottom insulated
mounting surface (in a location beneath the die), the device mounted on a
heatsink with thermal grease and a mounting torque of ≥ 6 in. lbs.
http://onsemi.com
MARKING
DIAGRAM
x = 2 or 7
G = Pb−Free Package
A = Assembly Location
Y = Year
WW = Work Week
COMPLEMENTARY SILICON
POWER DARLINGTONS
5.0 A, 100 V, 30 W
TO−220
CASE 221D−02
STYLE 2
MJF12xG
AYWW
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Device Package Shipping
†
ORDERING INFORMATION
MJF122 TO−220 50 Units / Rail
MJF122G TO−220
(Pb−Free)
50 Units / Rail
MJF127 TO−220 50 Units / Rail
MJF127G TO−220
(Pb−Free)
50 Units / Rail
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
COLLECTOR 2
BASE
1
EMITTER 3
COLLECTOR 2
BASE
1
EMITTER 3
NPN PNP
MJF122 MJF127
3
2
1