MJF122G

© Semiconductor Components Industries, LLC, 2008
September, 2008 Rev. 7
1 Publication Order Number:
MJF122/D
MJF122, MJF127
Complementary Power
Darlingtons
For Isolated Package Applications
Designed for generalpurpose amplifiers and switching
applications, where the mounting surface of the device is required to
be electrically isolated from the heatsink or chassis.
Features
Electrically Similar to the Popular TIP122 and TIP127
100 V
CEO(sus)
5.0 A Rated Collector Current
No Isolating Washers Required
Reduced System Cost
High DC Current Gain 2000 (Min) @ I
C
= 3 Adc
UL Recognized, File #E69369, to 3500 V
RMS
Isolation
PbFree Packages are Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Voltage V
CEO
100 Vdc
CollectorBase Voltage V
CB
100 Vdc
EmitterBase Voltage V
EB
5 Vdc
RMS Isolation Voltage (Note 1)
(t = 0.3 sec, R.H. 30%, T
A
= 25°C)
Per Figure 14
V
ISOL
4500 V
RMS
Collector Current Continuous
Peak
I
C
5
8
Adc
Base Current I
B
0.12 Adc
Total Power Dissipation (Note 2)
@ T
C
= 25_C
Derate above 25_C
P
D
30
0.24
W
W/_C
Total Power Dissipation @ T
A
= 25_C
Derate above 25_C
P
D
2
0.016
W
W/_C
Operating and Storage Junction Temperat-
ure Range
T
J
, T
stg
65 to
+ 150
I
C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, JunctiontoAmbient
R
q
JA
62.5
_C/W
Thermal Resistance, JunctiontoCase
(Note 2)
R
q
JC
4.1
_C/W
Lead Temperature for Soldering Purpose T
L
260
_C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Proper strike and creepage distance must be provided.
2. Measurement made with thermocouple contacting the bottom insulated
mounting surface (in a location beneath the die), the device mounted on a
heatsink with thermal grease and a mounting torque of 6 in. lbs.
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MARKING
DIAGRAM
x = 2 or 7
G = PbFree Package
A = Assembly Location
Y = Year
WW = Work Week
COMPLEMENTARY SILICON
POWER DARLINGTONS
5.0 A, 100 V, 30 W
TO220
CASE 221D02
STYLE 2
MJF12xG
AYWW
*For additional information on our PbFree strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Device Package Shipping
ORDERING INFORMATION
MJF122 TO220 50 Units / Rail
MJF122G TO220
(PbFree)
50 Units / Rail
MJF127 TO220 50 Units / Rail
MJF127G TO220
(PbFree)
50 Units / Rail
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
COLLECTOR 2
BASE
1
EMITTER 3
COLLECTOR 2
BASE
1
EMITTER 3
NPN PNP
MJF122 MJF127
3
2
1
MJF122, MJF127
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2
ELECTRICAL CHARACTERISTICS (T
C
= 25_C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
CollectorEmitter Sustaining Voltage (Note 3)
(I
C
= 100 mAdc, I
B
= 0)
V
CEO(sus)
100 Vdc
Collector Cutoff Current
(V
CE
= 50 Vdc, I
B
= 0)
I
CEO
10
mAdc
Collector Cutoff Current
(V
CB
= 100 Vdc, I
E
= 0)
I
CBO
10
mAdc
Emitter Cutoff Current (V
BE
= 5 Vdc, I
C
= 0) I
EBO
2 mAdc
ON CHARACTERISTICS (Note 3)
DC Current Gain (I
C
= 0.5 Adc, V
CE
= 3 Vdc)
DC Current Gain (I
C
= 3 Adc, V
CE
= 3 Vdc)
h
FE
1000
2000
CollectorEmitter Saturation Voltage (I
C
= 3 Adc, I
B
= 12 mAdc)
CollectorEmitter Saturation Voltage (I
C
= 5 Adc, I
B
= 20 mAdc)
V
CE(sat)
2
3.5
Vdc
BaseEmitter On Voltage (I
C
= 3 Adc, V
CE
= 3 Vdc) V
BE(on)
2.5 Vdc
DYNAMIC CHARACTERISTICS
SmallSignal Current Gain (I
C
= 3 Adc, V
CE
= 4 Vdc, f = 1 MHz) h
fe
4
Output Capacitance MJF127
(V
CB
= 10 Vdc, I
E
= 0, f = 0.1 MHz) MJF122
C
ob
300
200
pF
3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
Figure 1. Switching Times Test Circuit
V
CC
= 30 V
I
C
/I
B
= 250
I
B1
= I
B2
T
J
= 25°C
0.1 0.7 100.5
0.3
25
5
I
C
, COLLECTOR CURRENT (AMP)
t
d
@ V
BE(off)
= 0 V
t, TIME (s)μ
2
1
0.5
0.2
0.1
0.05
Figure 2. Typical Switching Times
t
s
t
f
0.3
3
0.2
1
0.07
0.7
37
PNP
NPN
1208 k
V
2
APPROX.
+8 V
V
1
APPROX.
-12 V
25 ms
R
B
51
D
1
+4 V
V
CC
- 30 V
R
C
SCOPE
TUT
t
r
, t
f
10 ns
DUTY CYCLE = 1%
FOR t
d
AND t
r
, D
1
IS DISCONNECTED
AND V
2
= 0
FOR NPN TEST CIRCUIT REVERSE ALL POLARITIES.
R
B
& R
C
VARIED TO OBTAIN DESIRED CURRENT LEVELS
D
1
, MUST BE FAST RECOVERY TYPES, e.g.,
1N5825 USED ABOVE I
B
100 mA
MSD6100 USED BELOW I
B
100 mA
t
r
0
MJF122, MJF127
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3
P
D
, POWER DISSIPATION (WATTS)
0
80
60
40
20
4
3
2
1
T
A
T
C
0
Figure 3. Maximum Power Derating
T, TEMPERATURE (°C)
40 60 100 120 16080 140
T
C
20
t, TIME (ms)
0.01
0.1 0.5 10 20 50 100 200 500 5K 10
K
152
1
0.2
0.1
0.05
r(t), TRANSIENT THERMAL
SINGLE PULSE
R
q
JC(t)
= r(t) R
q
JC
T
J(pk)
- T
C
= P
(pk)
R
q
JC
(t)
RESISTANCE (NORMALIZED)
Figure 4. Thermal Response
0.5
0.3
0.03
0.02
0.2
1K 2K30 3003
0.3
3K
T
A
V
CE
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 5. Maximum Forward Bias
Safe Operating Area
1
10
1
30
CURRENT LIMIT
SECONDARY BREAKDOWN
LIMIT
THERMAL LIMIT @
T
C
= 25°C (SINGLE PULSE)
I
C
, COLLECTOR CURRENT (AMPS)
0.1
23 50
3
0.3
10
0.2
d
c
T
J
= 150°C
1ms
5 ms
100 ms
2
5
0.5
5 10020
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate I
C
V
CE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 5 is based on T
J(pk)
= 150_C; T
C
is
variable depending on conditions. Secondary breakdown
pulse limits are valid for duty cycles to 10% provided T
J(pk)
< 150_C. T
J(pk)
may be calculated from the data in Figure 4.
At high case temperatures, thermal limitations will reduce
the power that can be handled to values less than the
limitations imposed by secondary breakdown.

MJF122G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Darlington Transistors 5A 100V Bipolar Power NPN
Lifecycle:
New from this manufacturer.
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