GP1A91LRJ00F Datasheet GP1A91LCJ00F, GP1A91LRJ00F | P7-P9

Sheet No.: D3-A01601EN

GP1A91LCJ00F

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Design Considerations

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Design guide

1) Prevention of detection error

To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to

the external light.

2) Position of opaque board

Opaque board shall be installed at place 1.6mm or more from the top of elements.

(Example)

This product is not designed against irradiation and incorporates non-coherent IRED.

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Degradation

In general, the emission of the IRED used in photointerrupter will degrade over time.

In the case of long term operation, please take the general IRED degradation (50% degradation over 5

years) into the design consideration.

Please decide the input current which become 2 times of MAX. I

FHL

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Parts

This product is assembled using the below parts.

• Photodetector (qty. : 1)

[Using a silicon photodiode as light detecting portion, and a bipolar IC as signal processing circuit]

Category Material

Maximum Sensitivity

wavelength (nm)

Sensitivity

wavelength (nm)

Response time (μs)

Photo diode Silicon (Si) 900 700 to 1 200 3

• Photo emitter (qty. : 1)

Category Material

Maximum light emitting

wavelength (nm)

I/O Frequency (MHz)

Infrared emitting diode

(non-coherent)

Gallium arsenide (GaAs) 950 0.3

1.6mm or more

Sheet No.: D3-A01601EN

GP1A91LCJ00F

• Material

Case Lead frame Lead frame plating

Black polyphernylene

sulﬁ de resin (UL94 V-0)

42Alloy SnCu plating

• Others

Laser generator is not used.

Sheet No.: D3-A01601EN

GP1A91LCJ00F

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Manufacturing Guidelines

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Soldering Method

Flow Soldering:

Soldering should be completed below 260˚C and within 5 s.

Please solder within one time.

Soldering area is 1 mm or more away from the bottom of housing.

Please take care not to let any external force exert on lead pins.

Please don't do soldering with preheating, and please don't do soldering by reﬂ ow.

Hand soldering

Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C.

Please solder within one time.

Please don't touch the terminals directly by soldering iron.

Soldered product shall treat at normal temperature.

Other notice

Please test the soldering method in actual condition and make sure the soldering works fine, since the

impact on the junction between the device and PCB varies depending on the cooling and soldering

conditions.

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Cleaning instructions

Solvent cleaning :

Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.

Ultrasonic cleaning :

Do not execute ultrasonic cleaning.

Recommended solvent materials :

Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.

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Presence of ODC

This product shall not contain the following materials.

And they are not used in the production process for this product.

Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)

Speciﬁ c brominated ﬂ ame retardants such as the PBBOs and PBBs are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).

•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated

diphenyl ethers (PBDE).

P1-P3 P4-P6 P7-P9 P10-P11

GP1A91LRJ00F

Mfr. #:

Buy GP1A91LRJ00F

Manufacturer:

Sharp Microelectronics

Description:

SENSOR OPTICAL 1.2MM PCB MOUNT

Lifecycle:

New from this manufacturer.

Delivery:

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GP1A91LRJ00F

GP1A91LRJ00F

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