FFSP1065A — Silicon Carbide Schottky Diode
Semiconductor Components Industries, LLC, 2017 Publication Order Number:
Sep, 2017, Rev.1.0 FFSP1065A/D
1
www.onsemi.com
Absolute Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FFSP1065A Unit
V
RRM
Peak Repetitive Reverse Voltage 650 V
E
AS
Single Pulse Avalanche Energy (Note 1) 64 mJ
I
F
Continuous Rectified Forward Current @ T
C
< 152
o
C 10
A
Continuous Rectified Forward Current @ T
C < 135 °C 15
I
F, Max
Non-Repetitive Peak Forward Surge Current
T
C
= 25
o
C, 10 μs 760 A
T
C
= 150
o
C, 10 μs 740 A
I
F,SM
N o n - R e p e t i t i v e F o r w a r d S u r g e C u r r e n t H a l f - S i ne Pulse, t
p
= 8.3 ms 56 A
I
F,RM
Repetitive Forward Surge Current Half-Sine Pulse, t
p
= 8.3 ms 38 A
Ptot Power Dissipation
T
C
= 25
o
C 111 W
T
C
= 150
o
C 19 W
T
J
, T
STG
Operating and Storage Temperature Range -55 to +175
o
C
Symbol Parameter
Ratings
Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 1.35
o
C/W
FFSP1065A
Silicon Carbide Schottky Diode
650 V, 10 A
Features
• Max Junction Temperature 175
o
C
• Avalanche Rated 64 mJ
• High Surge Current Capacity
• Positive Temperature Coefficient
• Ease of Paralleling
• No Reverse Recovery / No Forward Recovery
Applications
• General Purpose
• SMPS, Solar Inverter, UPS
• Power Switching Circuits
Description
Silicon Carbide (SiC) Schottky Diodes use a completely new
technology that provides superior switching performance and
higher reliability compared to Silicon. No reverse recovery
current, temperature independent switching characteristics, and
excellent thermal performance sets Silicon Carbide as the next
generation of power semiconductor. System benefits include
highest efficiency, faster operating frequency, increased power
density, reduced EMI, and reduced system size and cost.
TO-220-2L
1
1. Cathode 2. Anode
2
1. Cathode
2. Anode