NTMKE4892N
http://onsemi.com
5
PACKAGE DIMENSIONS
ICEPAK 6.3x4.9 − E1 PAD
CASE 145AE−01
ISSUE O
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.75
2.35
1.75
1.85
4X
1.45
2X
DIMENSIONS: MILLIMETERS
0.90
0.75
1.22
0.87
2X
4X
1.75
2.90
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE FLANGES
OF LEADFRAME ONLY.
SEATING
PLANE
D
E
A
A2
DIM
A
MIN MAX
MILLIMETERS
0.61 0.68
A1 0.02 0.08
F 0.98 BSC
A2 0.08 0.17
G 2.38 BSC
D 6.25 6.35
0.35 0.45
D2
GATE PAD
REFERENCE
0.08 C
0.08 C
NOTE 3
D3
D4
E2
2X
1.34 1.38
D3
TOP VIEW
SIDE VIEW
BOTTOM VIEW
F
0.64 0.68
D4
4.80 5.05
E
G
E3
3.85 3.95
E2
0.76 0.80
E3
0.64 0.68
E4
0.38 0.42
H
C
A1
2X
H
E4
D2
2X
0.12 C
A
A
0.12 C A
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NTMKE4892N/D
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