7
DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power
1. Recommended temperature
profi le
The temperature profi les are based on the above conditions.
In individual applications the actual temperature may vary,depending on solder paste type,
volume/thickness and board size/thickness. Consult your solder paste and equipment
manufacturer for specifi c recommendations.
2.Recommended manual soldering Manual soldering: 350ç ± 10ç for 3 seconds
3.
Recommended screen thickness and
open area ratio (Pattern area ratio)
Thickness: 0.1 mm
Open area ratio: 100%
4.Board warpage
Maximum of 0.02mm at the connector center, with both ends of the connector as reference points.
5.Cleaning conditions Cleaning is not recommended. When cleaning, please evaluate as if can deteriorate the
performance including mechanical operation and environmental resistance.
6.Precautions
■
When inserting crimp-type (solderless) terminals to crimping (solderless) sockets, to maintain
reliable performance, please do not insert obliquely.
■
DO NOT mate/un-mate non-terminated plugs with non-mounted receptacles.
This may lead to damage or deformation of the contacts.
■
Removal of the holding electric cable may cause damage so please be careful.
■
DO NOT apply fl ux to the contact terminals when hand soldering the receptacle to the board.
Wicking of the fl ux into the electrical contact areas may lead to connection failures.
■
Slight discoloration on the insulating materials will not affect form, fit or function of the
connectors.
■
Please refer to the documents "Cable assembly Procedure", "Crimp condition" and "Crimp
quality standards" for the cable assembly procedures.
■
Please refer to the "Mating/Unmating Operation Instruction Manual" for the connector
operation.
BUsage Recommendations
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Apr.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
