DATA SHEET
SE2574L: 2.4 GHz High Efficiency Wireless LAN PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202427A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 25, 2012 9
Package Handling Information
Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly. The SE2574L is capable of
withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or
in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For
details on both attachment techniques, precautions, and handling procedures recommended, please refer to:
“QFN solder reflow and rework information application note”, Document Number QAD-00045
“Handling, packing, shipping and use of moisture sensitive QFN application note”, Document Number
QAD-00044
Tape and Reel Information
Figure 8: SE2574L-R Tape and Reel Information
Caution! Class 1B ESD sensitive device
