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74AHCT245PW-Q100J
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
74AHC_AHCT245_Q1
00
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2013. All rights reserv
e
d.
Product data sheet
Rev
. 1 —
21 March 2013
12 of 17
NXP Semiconductors
74AHC245-Q100; 74AHCT245-Q100
Oct
al bus transc
eiver; 3-st
ate
Fig 9.
Package outline
SOT360-1 (TSSOP20)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1
MO-153
99-12-27
03-02-19
w
M
b
p
D
Z
e
0.25
11
0
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
74AHC_AHCT245_Q1
00
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2013. All rights reserv
e
d.
Product data sheet
Rev
. 1 —
21 March 2013
13 of 17
NXP Semiconductors
74AHC245-Q100; 74AHCT245-Q100
Oct
al bus transc
eiver; 3-st
ate
Fig 10.
Package
outline SOT764-1 (DHVQFN2
0)
terminal 1
index area
0.5
1
A
1
E
h
b
UNIT
y
e
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
4.6
4.4
D
h
3.15
2.85
y
1
2.6
2.4
1.15
0.85
e
1
3.5
0.30
0.18
0.05
0.00
0.05
0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1
MO-241
- - -
- - -
0.5
0.3
L
0.1
v
0.05
w
0
2.5
5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
29
19
12
11
10
1
20
X
D
E
C
B
A
terminal 1
index area
A
C
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
02-10-17
03-01-27
74AHC_AHCT245_Q1
00
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2013. All rights reserv
e
d.
Product data sheet
Rev
. 1 —
21 March 2013
14 of 17
NXP Semiconductors
74AHC245-Q100; 74AHCT245-Q100
Oct
al bus transc
eiver; 3-st
ate
12. Abbreviations
13. Revision
history
T
able 10.
Abbreviations
Acronym
Description
CDM
Charged Device Mo
del
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under T
est
ESD
ElectroS
t
atic Discharge
HBM
Human Body Model
MM
Machine Model
MIL
Milit
ary
TTL
T
ransistor-T
ransistor Logic
T
able 1
1
.
Revision history
Document ID
Release date
Dat
a sheet status
Change notice
Supersedes
74AHC_AHCT245_Q10
0 v
.1
20130321
Produ
ct data sheet
-
-
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
74AHCT245PW-Q100J
Mfr. #:
Buy 74AHCT245PW-Q100J
Manufacturer:
Nexperia
Description:
Bus Transceivers 74AHCT245PW-Q100/TSSOP20/REEL
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
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