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NB100LVEP17MNG

P1-P3P4-P6P7-P9P10-P10
NB100LVEP17
http://onsemi.com
7
Figure 4. Output Voltage Amplitude (V
OUTPP
) / RMS Jitter vs.
Input Frequency (f
in
) at V
CC
= 2.5 V, Ambient Temperature
INPUT FREQUENCY (GHz)
2.52.01.51.00.5
250
350
450
550
650
750
850
OUTPUT VOLTAGE AMPLITUDE
(mV)
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
RMS JITTER (ps)
Figure 5. Output Voltage Amplitude (V
OUTPP
) / RMS Jitter vs.
Input Frequency (f
in
) at V
CC
= 3.3 V, Ambient Temperature
INPUT FREQUENCY (GHz)
2.52.01.51.00.5
250
350
450
550
650
750
850
OUTPUT VOLTAGE AMPLITUDE (mV)
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
RMS JITTER (ps)
Q AMP (mV)
RMS JITTER (ps)
Q AMP (mV)
RMS JITTER (ps)
Figure 6. AC Reference Measurement
D
D
Q
Q
t
PHL
t
PLH
V
INPP
= V
IH
(D) − V
IL
(D)
V
OUTPP
= V
OH
(Q) − V
OL
(Q)
NB100LVEP17
http://onsemi.com
8
Figure 7. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50
Z
o
= 50
50 50
V
TT
V
TT
= V
CC
− 2.0 V
ORDERING INFORMATION
Device Package Shipping†
NB100LVEP17DTG
TSSOP−20
(Pb−Free)
75 Units / Rail
NB100LVEP17DTR2G 2500 Tape & Reel
NB100LVEP17MNG
QFN−24
(Pb−Free)
92 Units / Rail
NB100LVEP17MNR2G 3000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D − ECL Clock Distribution Techniques
AN1406/D − Designing with PECL (ECL at +5.0 V)
AN1503/D −
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D − Metastability and the ECLinPS Family
AN1568/D − Interfacing Between LVDS and ECL
AN1672/D − The ECL Translator Guide
AND8001/D − Odd Number Counters Design
AND8002/D − Marking and Date Codes
AND8020/D − Termination of ECL Logic Devices
AND8066/D − Interfacing with ECLinPS
AND8090/D − AC Characteristics of ECL Devices
NB100LVEP17
http://onsemi.com
9
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
D
G
H
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P9P10-P10

NB100LVEP17MNG

Mfr. #:
Buy NB100LVEP17MNG
Manufacturer:
ON Semiconductor
Description:
Bus Receivers 2.5V/3.3V/5V ECL Quad Diff Driver
Lifecycle:
New from this manufacturer.
Delivery:
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