© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 6
1 Publication Order Number:
NCS5000/D
NCS5000
Integrated RF Schottky
Detector
The NCS5000 is an integrated Schottky detector intended for use as
a level detector in RF measurement/power control applications such as
those found in GSM handsets. The detector converts the peak RF
voltage applied to a DC level. The circuit consists of an RF Schottky
detector, a reference Schottky diode, as well as biasing and control
circuitry. There is an enable input that allows the part to be placed in a
low power state when not in use.
The detector is designed for operation up to 2.0 GHz and can operate
with input power levels up to +25 dBm. There is a fixed offset of 10 mV
(nominal) between the Reference Detector and the RF Detector under
no applied RF. The two detectors are monolithically integrated so that
they closely track overtemperature, voltage and process.
The NCS5000 is housed in a very small TSOP−6 package ideal for
portable applications. The TSOP−6 package is a lower profile,
footprint compatible package to the SOT23−6.
Features
• Wide Operating Frequency Range to 2.0 GHz
• 2.7 V − 5.5 V Operating Voltage
• Very Low Operating Current of 300 mA
• Enable Control to Place the Part in a Low Current Standby Mode
• Typical Standby Current of < 1.0 mA
• −40°C to 85°C Operating Temperature Range
• Very Small TSOP−6 Package
• Pb−Free Package is Available
Typical Applications
• Cellular Handsets (GSM and DCS1800/PCS1900)
• Wireless Data Modems
• Transmitter Power Measurement and Control
• Test Equipment
Enable
Compensated
Current Sources
RF_In
DET_OUT
REF
V
CC
GND
This circuit has 28 active transistors
Figure 1.
PIN CONNECTIONS AND
MARKING DIAGRAM
1
3
RF_In
DET_OUT
2V
CC
Enable
4
REF
6
(Top View)
TSOP−6
SN SUFFIX
CASE 318G
Device Package Shipping
†
ORDERING INFORMATION
NCS5000SNT1 TSOP−6 3000/Tape & Ree
5
GND
BACAYWG
G
http://onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1
BAC = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G = Pb−Free Package
NCS5000SNT1G TSOP−6
(Pb−Free)
3000/Tape & Ree
(Note: Microdot may be in either location)