SML-P12WTT86R Datasheet SMLP13EC8TT86, SML-P13PTT86R, SML-P12VTT86R | P7-P9

[Data Sheet]

１．Storage

If the product is heated during the reflow under the condition of hygroscopic state,

it may vaporize and expand which will influence the performance of the product.

Therefore, the package is waterproof. Please use the product following the conditions:

・Using Conditions

・Baking

Bake the product in case of below:

①The expiration date is passed.

②The color of indicator (silica gel) turned from blue to colorless or from green to pink.

・Baking Conditions

２．Application Methods

２－１．Precaution for Drive System and Oﬀ Mode

Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that

please do not apply voltage neither forward nor reverse. Especially, for the products with the

Ag-paste used in the die bonding, there’s high possibility to cause electro migration and result

２－２．Derating

　The Derating Characteristics are based on the lifetime of luminous intensity and assumption

of degradation & color change of sealing resin or reflector. About its reliability,

２－３．Operation Life Span

There’s possibility for intensity of light drop according to working conditions and environments

(applied current, surrounding temperature and humidity, corrosive gases), please call our Sales

①Longtime intensity of light life

②On mode all the time

２－４．Applied Stress on Product

No resin hardening agent such as filler is used in the sealing resin of the product.

Therefore, please pay attention to the overstress on it which may influence its reliability.

２－５．Usage

The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,

Classification

①Before using

②After opening

package

Temperature

5〜30℃

30〜70%RH

Below 70%RH

Humidity

Please storing in the airtight container

with our desiccant (silica gel)

Temperature

60±3℃

Time

12〜24h

Humidity

Below 20%RH

Remark

[SML-P12x/P13x series]

■Precaution (Surface Mount Device)

Expiration Date

Within 1 year

from Receiving

Within 168h

Remark

Storage with waterproof package

・Bake products in reel.

・Reel and embossed tape are easy to be deformed when baking,

・Recommend bake once.

(Even if the product is within the expiration date.)

so please try not to apply stress on it.

applies on the products. If drive by constant voltage, it may cause current deviation of the LED and

result in deviation of luminous intensity, so we recommend to drive by constant current.

(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,

please evaluate its using conditions and environment and use it after confirmed there is no problem.

in function failure.

staffs for inquiries about the concerned application below.

Rectifier, Switching and so on.

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[Data Sheet]

３．Others

３－１．Surrounding Gas

Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or

alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of

the plating surface ) or optical characteristics changes (light intensity, chrominance) and change

in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of

Therefore, please pay attention to the storage environment for mounted product (concern the

３－２．Electrostatic Damage

The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged

by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from

human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance

value of electrostatic discharge and it is recommended to introduce the ESD protection circuit.

The resistance values of electrostatic discharge (actual values) vary with products, therefore,

please call our Sales staffs for inquiries.

３－３． Electromagnetic Wave

Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,

therefore please evaluate before using it.

the products.

[SML-P12x/P13x series]

generated gas of the surrounding parts of the products and the atmospheric environment).

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[Data Sheet]

Stress strength according to

he mounting position:

A＞B＞C＞D

so please pay attention to the touch on product.

We recommend the soldering pattern that shows on the right.

It will be different according to mounting situation of circuit board,

therefore, please concern before designing.

※The product has adopted the electrode structure that it should solder

with back electrode of the product.

Thus, please be informed that the shape of electrode pin of

solder fillet formation is not guaranteed.

The through hole on electrode surface is for conduction of front

　and rear electrodes but not for formation of solder ﬁllet.

４―４. Mechanical Stress after Mounting

The mechanical stress may damage the LED after Circuit Mounting,

４－５．Soldering Pattern for Recommendation

to prevent electrostatic charge.

４－３. Mounting Location

The stress like bending stress of circuit board dividing after mounting, may cause LED package crack

or damage of LED internal junction, therefore, please concern the mounting direction and position

　one of its speciﬁc characteristics is that solder will penetrate into LED. Thus, there's high possibility

４-２-１. Silicon Resin Sealing Product

The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress

４-２-２. Mini Package (Smaller than 1608 size)

・Vibration may result in low mounting rate since it will cause the static electricity of product and

with other parts within the usage limitation after open the moistureproof package.

・Compare with N2 reﬂow, during air reﬂow, because of the heat and surrounding conditions,

it may cause the discoloration of the resin.

・For our product that has no solder resist, because of its solder amount and soldering conditions,

４－２. Automatic Mounting

・The product is not guaranteed for ﬂow soldering.

In case of carrying out flow soldering of surrounding parts without recommended conditions, please

・Please set appropriate reﬂow temperature based on our product usage conditions and speciﬁcation.

・The max for reﬂowing is 2 times, please ﬁnish the second reﬂow soldering and ﬂow soldering

[SML-P12x/P13x series]

４．Mounting

４－１. Soldering

・No resin hardening agent such as ﬁller is used in the sealing resin of the product. Therefore, resin

expansion and moisture absorption at humidity will cause heat stress during soldering process and

・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature

shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.

finally has bad influence on the product’s reliability.

that will influence its reliability.Therefore, please be informed, concerning it before using it.

directly on the sealing section.

adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of

the mounter to control the product stabilization. In addition, it is recommended to set ionizer

to avoid bending or screwing with great stress of the circuit board.

0.6mm

0.4mm

0.5mm

PCB Bonding Direction

Mask open area ratio：80%

Mask thickness：80〜100μm

Reference

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P1-P3 P4-P6 P7-P9 P10-P12

SML-P12WTT86R

Mfr. #:

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LED YELLOW CLEAR 1006 SMD

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SML-P12WTT86R

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