CM6100
http://onsemi.com
3
PACKAGE DIMENSIONS
WLCSP4, 0.8x0.8
CASE 567CB−01
ISSUE O
SEATING
PLANE
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
0.57
MILLIMETERS
A1
D 0.80 BSC
E
b 0.24 0.29
e 0.40 BSC
0.63
D
E
A
B
PIN A1
REFERENCE
e
A0.05 BC
0.03
C
0.05 C
4X
b
12
B
A
0.05 C
A
A1
A2
C
0.17 0.24
0.80 BSC
0.05 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
e
A2 0.41 REF
PITCH
0.25
4X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.40
0.40
RECOMMENDED
A1
PACKAGE
OUTLINE
PITCH
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CM6100/D
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