FF
E
D
C
B
A
7654321
3
A
B
C
D
E
F
1 2 4 5 6 7 8
8
Copyright FCI.
REV F - 2006-04-17
A
A
0.14
(2x)2
0
-0.1
4.3
0.8
0.61 0.07
12.8 13.9
29.2 0.2
15.1
( )21.8
21.6 0.2
32.1 0.2
54.3 0.05
0.1 A
= =57.8
26.35
5.08
2.54
0.2 C
1 0.05
R1
20.32
3.94
20
10.16
3.6
33.68 0.2
0.9 0.05
0.1 B
25.4 0.1
2.54
17.78
0.2 C
0.8 0.05
( )1.8
( )1.2
R0.3
A
ltr ecn no dr date
A LS2030 PRI 2002/04/26
B -- -- --
C
LS05-0047
LGO 2005/06/08
D LS05-0059 HLE 2005/06/30
E LS06-0206 HLE 2006/12/12
F I08-0035 RPK 2008/03/07
G I09-0239 RPK 2009/10/30
TIN LEAD CATALOGUE NUMBER
7312P0235A13
sheet 1 of 2
CUSTOMER7312P0235A13
catalog no
F
VJW53665
dwg no
TYPE : P02 (16cts with cover)
title
Rev.
CHIP CARD CONNECTOR
--Spec refMOBILE I/OProduct family2007/02/26SUDHIR V
Appr
I09-0239ECN
0.050.XXX
LINEAR
20
2007/02/26RAMESH P K
Chr
3:1
A2
0.10.XX
ANGULAR
1996/08/26TISSERAND
Eng
Scale
size
0.30.X
1996/08/26LEGRAND
Dr
TOLERANCES UNLESS OTHERWISE SPECIFIED
www.fciconnect.com
mm
ISO 1101ISO 406ISO 1302
projection
tolerance std--surface
DESCRIPTION
Connector especially designed for SMT technology
EMV compatible and in accordance with ISO 7816-2
MECHANICAL
Contacts force : between 0.2N-0.5N
Durability : 100000 cycles
Insertion force : 10N max
Extraction force : 3N min
ELECTRICAL
Insulation resistance : 1000MOhms
Dielectric withstand voltage between card contacts
and detection switch : 1000 Vrms
contact resistance:100 miliohms
Current carrying : min 10 microA max 1A
SWITCH
Contact closed : contact resistance 100mOhms
Open contact : voltage proof 300Vms
MATERIAL
Contacts : copper alloy
Plating : Gold / Equivalent PdNi over Nickel on contact area
Solder talls : Sn bare edge allowed
Housing : self extinguishing, Thermoplastic
UL94-V0 rated
ENVIRONMENT
Storage temperature : -40 C, +85 C
Operating temperature : -20 C, +70 C
Packaging : Tray
Compatible reflow soldering process
STOP CARD
SCALE 2:1
Pick and place area
SECTION
A-A
SCALE 10:1
B
C
CUSTOMER USE for LF References:
Oncethe plastic bag has been opened, the product should be soldered to the PCB within the next 24 hours.
If soldering is delayed for more than 24 hours ,then the product has to be dried again during 24 hours at 125º 5º.
Please store at ambient temperature to avoid condensation.
5.1 0.1
0.01
+0.1
0
LEAD FREE CATALOGUE NUMBER
7312P0235A13LF
PDM: Rev:G Released .STATUS: Printed: Oct 29, 2011
