ZXTC2045E6
Document Number: DS33645 Rev: 3 - 2
2 of 6
www.diodes.com
March 2015
© Diodes Incorporated
ADVANCE INFO R MA T I O N
Absolute Maximum Ratings – Q1 (NPN Transistor)
(@T
A
= +25°C, unless otherwise specified.)
Collector-Base Voltage
V
40 V
Collector-Emitter Voltage
V
40 V
Collector-Emitter Voltage
V
30 V
Emitter-Base Voltage
V
7 V
Continuous Collector Current
I
1.5 A
Peak Pulsed Collector Current
I
5 A
Base Current
I
1 A
Absolute Maximum Ratings – Q2 (PNP Transistor)
(@T
A
= +25°C, unless otherwise specified.)
Collector-Base Voltage
V
-40 V
Collector-Emitter Voltage
V
-40 V
Collector-Emitter Voltage
V
-30 V
Emitter-Base Voltage
V
-7 V
Continuous Collector Current
I
-1.5 A
Peak Pulsed Collector Current
I
-5 A
Base Current
I
-1 A
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Power Dissipation
Linear Derating Factor
(Notes 6 & 10)
P
D
0.7
5.6
W
mW/°C
(Notes 7 & 10)
0.9
7.2
(Notes 7 & 11)
1.1
8.8
(Notes 8 & 10)
1.1
8.8
(Notes 9 & 10)
1.7
13.6
Thermal Resistance, Junction to Ambient
(Notes 6 & 10)
R
θ
JA
179
°C/W
(Notes 7 & 10) 139
(Notes 7 & 11) 113
(Notes 8 & 10) 113
(Notes 9 & 10) 73
Thermal Resistance, Junction to Lead (Note 12)
R
95.50
Operating and Storage Temperature Range
T
, T
-55 to +150 °C
ESD Ratings
(Note 13)
Characteristic Symbol Value Unit JEDEC Class
Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A
Electrostatic Discharge - Machine Model ESD MM 400 V C
Notes: 6. For a device surface mounted on 15mm x 15mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured
when operating in a steady-state condition.
7. Same as Note 6, except the device is surface mounted on 25mm x 25mm 1oz copper.
8. Same as Note 6, except the device is surface mounted on 50mm x 50mm 2oz copper.
9. Same as Note 8, except the device is measured at t < 5 seconds.
10. For device with one active die, both collectors attached to a common heatsink.
11. For device with two active die running at equal power, split heatsink 50% to each collector.
12. Thermal resistance from junction to solder-point (at the end of the collector lead).
13. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
