Philips Semiconductors Product data
PCK12429
25–400 MHz differential PECL clock generator
2002 Jun 03
7
SW00730
N DIVIDE
(2, 4, 8, 16)
PLL 12429
SHIFT
REG
14-BIT
VCO_CLK
F
REF
MCNT
0
1
F
OUT
(VIA ENABLE GATE)
SEL_CLK
SCLOCK
SDATA
T0
T1
T2
DECODE
LATCH
Reset
M COUNTER
SLOAD
PLOADB
FDIV4
MCNT
LOW
F
OUT
MCNT
F
REF
HIGH
TEST
MUX
0
7
TEST
T2 = T1 = 1. T0 = 0: Test Mode
SCLOCK is selected, MCNT is on TEST output, SCLOCK DIVIDE BY N is on F
OUT
pin.
PLOADB acts as reset for test pin latch. When latch reset T2 data is shifted out TEST pin.
Figure 2. Serial Test Clock Block Diagram
DC CHARACTERISTICS (T
amb
= 0 to 70 °C, V
CC
= 3.3 V ± 5%)
SYMBOL
PARAMETER
CONDITION
LIMITS
UNIT
SYMBOL
PARAMETER
CONDITION
MIN TYP MAX
UNIT
V
IH
Input HIGH Voltage V
CC
= 3.3 V 2.0 V
V
IL
Input LOW Voltage V
CC
= 3.3 V 0.8 V
I
IN
Input Current 1.0 mA
V
OH
Output HIGH Voltage TEST I
OH
= –0.8 mA 2.5 V
V
OL
Output LOW Voltage TEST I
OL
= 0.8 mA 0.4 V
V
O
Out
p
ut HIGH Voltage
F
OUT
V
CC0
= 3.3 V
217
250
V
V
OH
O
u
tp
u
t
HIGH
Voltage
F
OUT
CC0
(Notes 1 and 2)
2
.
17
2
.
50
V
V
O
Out
p
ut LOW Voltage
F
OUT
V
CC0
= 3.3 V
141
176
V
V
OL
O
u
tp
u
t
LOW
Voltage
F
OUT
CC0
(Notes 1 and 2)
1
.
41
1
.
76
V
I
CC
Power Su
pp
ly Current
V
CC1
85 100
mA
I
CC
Po
w
er
S
u
ppl
y
C
u
rrent
PLL_V
CC
15 20
mA
NOTES:
1. Output levels will vary 1:1 with V
CC0
variation.
2. 50 to V
CC
– 2.0 V pulldown.
Philips Semiconductors Product data
PCK12429
25–400 MHz differential PECL clock generator
2002 Jun 03
8
AC CHARACTERISTICS (T
amb
= 0 to 70 °C, V
CC
= 3.3 V ± 5%)
SYMBOL PARAMETER TEST CONDITIONS
LIMITS
T
amb
= 0 to +70 °C
UNIT
MIN MAX
F
Maximum In
p
ut Frequency
S_CLOCK
10
MHz
F
MAXI
Ma
x
im
u
m
Inp
u
t
Freq
u
enc
y
Xtal Oscillator
10 20
MH
z
F
O
Maximum Out
p
ut Frequency
VCO (Internal)
200 400
MHz
F
MAXO
Ma
x
im
u
m
O
u
tp
u
t
Freq
u
enc
y
F
OUT
25 400
MH
z
t
LOCK
Maximum PLL Lock Time 10 ms
t
jitter
RMS jitter (peak-to-peak)
Note 2
See Applications Section
±25 ps
S_DATA to
S_CLOCK
20
t
s
Setup Time
S_CLOCK TO
S_LOAD
20
ns
M, N to P_LOAD 20
t
n
Hold Time
S_DATA to
S_CLOCK
20
ns
n
M, N to P_LOAD 20
t
p
w
Minimum Pulse Width
S_LOAD
50
ns
tp
w
MIN
Minim
u
m
P
u
lse
Width
P_LOAD
50
ns
t
r
, t
f
Output Rise/Fall F
OUT
20%–80%, Note 2 100 400 ps
Duty Cycle 45 55 %
NOTES:
1. 10 MHz is the maximum frequency to load the feedback device registers. S_CLOCK can be switched at higher frequencies when used as a
test clock in TEST_MODE 6. Crystal frequency of 16MHz verified at productiontest. 10 to 20MHz operationguaranteed by design.
2. 50 to V
CC
–2.0 V pulldown.
APPLICATIONS INFORMATION
Using the on-board crystal oscillator
The PCK12429 features a fully integrated on-board crystal oscillator
to minimize system implementation costs. The oscillator is a series
resonant, multivibrator type design as opposed to the more common
parallel resonant oscillator design. The series resonant design
provides better stability and eliminates the need for large on chip
capacitors. The oscillator is totally self contained so that the only
external component required is the crystal. As the oscillator is
somewhat sensitive to loading on its inputs, the user is advised to
mount the crystal as close to the PCK12429 as possible to avoid
any board level parasitics. To facilitate co-location surface mount
crystals are recommended, but not required. Because the series
resonant design is affected by capacitive loading on the XTAL
terminals, loading variation introduced by crystals from different
vendors could be a potential issue.
The oscillator circuit is a series resonant circuit and thus for
optimum performance a series resonant crystal should be used.
Unfortunately most crystals are characterized in a parallel resonant
mode. Fortunately there is no physical difference between a series
resonant and a parallel resonant crystal. The difference is purely in
the way the devices are characterized. As a result, a parallel
resonant crystal can be used with the PCK12429 with only a minor
error in the desired frequency. A parallel resonant mode crystal used
in a series resonant circuit will exhibit a frequency of oscillation a
few hundred ppm lower than specified, a few hundred ppm
translates to kHz inaccuracies. In a general computer application
this level of inaccuracy is immaterial. Table 2 specifies the
performance requirements of the crystals to be used with the
PCK12429.
Table 2. Test modes
PARAMETER VALUE
Crystal Cut Fundamental AT Cut
Resonance Series Resonance*
Frequency Tolerance ±75 ppm at 25 °C
Frequency/Temperature Stability ±150 pm 0 to 70 °C
Operating Range 0 to 70 °C
Shunt Capacitance 5–7 pF
Equivalent Series Resistance (ESR) 50 to 80
Correlation Drive Level 100 µW
Aging 5 ppm/Yr (first 3 years)
NOTE:
* See accompanying text for series versus parallel resonant
discussion.
Philips Semiconductors Product data
PCK12429
25–400 MHz differential PECL clock generator
2002 Jun 03
9
Power supply filtering
The PCK12429 is a mixed analog/digital product and as such it
exhibits some sensitivities that would not necessarily be seen on a
fully digital product. Analog circuitry is naturally susceptible to
random noise, especially if this noise is seen on the power supply
pins. The PCK12429 provides separate power supplies for the
digital circuitry (V
CC
) and the internal PLL (PLL_V
CC
) of the device.
The purpose of this design technique is to try and isolate the high
switching noise digital outputs from the relatively sensitive internal
analog phase-locked loop. In a controlled environment such as an
evaluation board, this level of isolation is sufficient. However, in a
digital system environment where it is more difficult to minimize
noise on the power supplies, a second level of isolation may be
required. The simplest form of isolation is a power supply filter on
the PLL_V
CC
pin for the PCK12429.
Figure 3 illustrates a typical power supply filter scheme. The
PCK12429 is most susceptible to noise with spectral content in the
1 kHz to 2 MHz range. A good choice of pole placement should be
close to 32 kHz. Therefore the filter should be designed to target this
range. The key parameter that needs to be met in the final filter
design is the DC voltage drop that will be seen between the V
CC
supply and the PLL_V
CC
pin of the PCK12429. From the data sheet
the I
PLL_VCC
current (the current sourced through the PLL_V
CC
pin)
is typically 15 mA (20 mA maximum), assuming that a minimum of
3.0 V must be maintained on the PLL_V
CC
pin, very little DC voltage
drop can be tolerated when a 3.3 V V
CC
supply is used. The resistor
shown in Figure 3 must have a resistance of 10–15 to meet the
voltage drop criteria. The RC filter pictured will provide a broadband
filter with approximately 100:1 attenuation for noise whose spectral
content is above 20 kHz. As the noise frequency crosses the series
resonant point of an individual capacitor, its overall impedance
begins to look inductive and thus increases with increasing
frequency. The parallel capacitor combination shown ensures that a
low impedance path to ground exists for frequencies well above the
bandwidth of the PLL.
V
CC
SW00745
PLL_V
CC
PCK12429
0.01 µF
22 µF
R
S
= 10–15
L = 1000 µH
R = 15
3.3 V
3.3 V
Figure 3. Power supply filter
A higher level of attenuation can be achieved by replacing the
resistor with an appropriate valued inductor. Figure 3 shows a
1000 µH choke, this value choke will show a significant impedance
at 10 KHz frequencies and above. Because of the current draw and
the voltage that must be maintained on the PLL_V
CC
pin, a low DC
resistance inductor is required (less than 15 ). Generally the
resistor/capacitor filter will be cheaper, easier to implement, and
provide an adequate level of supply filtering.
The PCK12429 provides sub-nanosecond output edge rates, and
thus a good power supply bypassing scheme is a must. Figure 4
shows a representative board layout for the PCK12429. There exists
many different potential board layouts and the one pictured is but
one. The important aspect of the layout in Figure 4 is the low
impedance connections between V
CC
and GND for the bypass
capacitors. Combining good quality general purpose chip capacitors
with good PCB layout techniques will produce effective capacitor
resonances at frequencies adequate to supply the instantaneous
switching current for the PCK12429 outputs. It is imperative that low
inductance chip capacitors are used; it is equally important that the
board layout does not introduce back all of the inductance saved by
using the leadless capacitors. Thin interconnect traces between the
capacitor and the power plane should be avoided and multiple large
vias should be used to tie the capacitors to the buried power planes.
Fat interconnect and large vias will help to minimize layout induced
inductance and thus maximize the series resonant point of the
bypass capacitors.
SW00746
Xtal
1
C3 C2
=
VCC
=
GND
=
Via
C1 C1
R1
=
10–15
C1
=
0.01
µ
F
C2
=
22
µ
F
C3
=
0.1
µ
F
R1
Figure 4. PCB board layout for PCK12429
Note the dotted lines circling the crystal oscillator connection to the
device. The oscillator is a series resonant circuit and the voltage
amplitude across the crystal is relatively small. It is imperative that
no actively switching signals cross under the crystal, as crosstalk
energy coupled to these lines could significantly impact the jitter of
the device. Special attention should be paid to the layout of the
crystal to ensure a stable, jitter free interface between the crystal
and the on-board oscillator.
Although the PCK12429 has several design features to minimize the
susceptibility to power supply noise (isolated power and grounds
and fully differential PLL) there still may be applications in which
overall performance is being degraded due to system power supply
noise. The power supply filter and bypass schemes discussed in this
section should be adequate to eliminate power supply noise related
problems in most designs.

PCK12429D,518

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC CLOCK GENERATOR PECL 28SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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