FDW254PZ Rev. C1 (W)
Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage
V
GS
= 0 V, I
D
= –250 µA
–20 V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
I
D
= –250 µA, Referenced to 25°C
–11
mV/°C
I
DSS
Zero Gate Voltage Drain Current V
DS
= –16 V, V
GS
= 0 V –1
µA
I
GSS
Gate–Body Leakage
V
GS
= ±8 V, V
DS
= 0 V
±10 µA
On Characteristics (Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= –250 µA
–0.4 –0.6 –1.5 V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= –250 µA, Referenced to 25°C
2
mV/°C
R
DS(on)
Static Drain–Source
On–Resistance
V
GS
= –4.5 V, I
D
= –9.2 A
V
GS
= –2.5 V, I
D
= –7.9 A
V
GS
= –1.8 V, I
D
= –6.5 A
V
GS
=–4.5 V, I
D
=–9.2 A, T
J
=125°C
9
11
14
12
12
15
21.5
18
mΩ
I
D(on)
On–State Drain Current V
GS
= –4.5 V, V
DS
= –5 V –50 A
g
FS
Forward Transconductance V
DS
= –5 V, I
D
= –9.2 A 54 S
Dynamic Characteristics
C
iss
Input Capacitance 5880 pF
C
oss
Output Capacitance 990 pF
C
rss
Reverse Transfer Capacitance
V
DS
= –10 V, V
GS
= 0 V,
f = 1.0 MHz
560 pF
R
G
Gate Resistance
V
GS
= 15 mV, f = 1.0 MHz
4.9
Ω
Switching Characteristics (Note 2)
t
d(on)
Turn–On Delay Time 15 27 ns
t
r
Turn–On Rise Time 15 27 ns
t
d(off)
Turn–Off Delay Time 210 336 ns
t
f
Turn–Off Fall Time
V
DD
= –10 V, I
D
= –1 A,
V
GS
= –4.5 V, R
GEN
= 6 Ω
100 160 ns
Q
g
Total Gate Charge 60 96 nC
Q
gs
Gate–Source Charge 7 nC
Q
gd
Gate–Drain Charge
V
DS
= –10 V, I
D
= –9.2 A,
V
GS
= –4.5 V
13 nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current –1.2 A
V
SD
Drain–Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= –1.2 A (Note 2) –0.5 –1.2 V
t
rr
Reverse Recovery Time 35 ns
Q
rr
Reverse Recovery Charge
I
F
= –9.2 A,
d
iF
/d
t
= 100 A/µs
21 nC
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting
surface of the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) R
θJA
is 96°C/W (steady state) when mounted on a 1 inch
2
copper pad on FR-4.
b) R
θJA
is 208°C/W (steady state) when mounted on a minimum copper pad on FR-4.
2. Pulse Test: Pulse Width < µs, Duty cycle < 2.0%.
