Spec No.JELF243A-0102F-01 P.6/12
MURATA MFG.CO., LTD
Reference
Only
7.Mechanical Performance
No. Item Specification Test Method
7.1
Shear Test
Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
(in mm)
Applied Direction:
Force:5N
Hold Duration:5s±1s
7.2 Bending Test Substrate:Glass-epoxy substrate
(100mm×40mm×1.6mm)
Speed of Applying Force:1mm / s
Deflection:2mm
Hold Duration:30s
7.3 Vibration Chip coil shall not be damaged
after tested as test method.
Oscillation Frequency:
10Hz~55Hz~10Hz for 1 min
Total Amplitude:1.5mm
Testing Time:
A period of 2 hours in each of 3 mutually
perpendicular directions.
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time: 3s±1s
7.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±5%
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
Chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:270°C±5°C
Immersion Time:10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8.Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
8.1 Heat Resistance Appearance:No damage
Inductance Change: within ±5%
Q Change: within ±20%
Temperature:125°C±2°C
Time:1000h (+48h,0h)
Then measured after exposure in the room
condition for 24h±2h.
Substrate
F
Chip Coil
2.2
0.7
0.7
Chip Coil
Pattern
Solder resist
Substrate
2.00
0.86
1.15
45
R230
F
Deflection
45
Product
Pressure jig
(in mm)
