MC100EP16VTDR2G

MC100EP16VT
http://onsemi.com
7
Figure 7. Alternate “Y” Termination Method, V
TT
Pin 4
1
2
3
45
6
7
8
Q*
V
EE
V
CC
D
Q
*D
V
TT
V
CTRL
V
CTRL
+
50
50
V
EE
R
T
V
CC
R
T
5.0 V
3.3 V
112
46
*See Figure 9.
0
100
200
300
400
500
600
700
800
900
1000
0 500 1000 1500 2000 2500 3000 3500 4000
1
2
3
4
5
6
7
8
9
10
Figure 8. F
max
/Jitter
FREQUENCY (MHz)
(JITTER)
0.25 V Below V
CC
0.75 V Below V
CC
1.00 V Below V
CC
1.25 V Below V
CC
2.00 V Below V
CC
V
OUTpp
(mV)
JITTER
OUT
ps (RMS)
MC100EP16VT
http://onsemi.com
8
V
TT
=
V
CC
– 2.0 V
Figure 9. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020 – Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
Q
Qb
D
Db
50
50
V
TT
Resource Reference of Application Notes
AN1404
ECLinPS Circuit Performance at Non–Standard V
IH
Levels
AN1405
ECL Clock Distribution Techniques
AN1406
Designing with PECL (ECL at +5.0 V)
AN1504
Metastability and the ECLinPS Family
AN1568
Interfacing Between LVDS and ECL
AN1650
Using Wire–OR Ties in ECLinPS Designs
AN1672
The ECL Translator Guide
AND8001
Odd Number Counters Design
AND8002
Marking and Date Codes
AND8009
ECLinPS Plus Spice I/O Model Kit
AND8020
Termination of ECL Logic Devices
For an updated list of Application Notes, please see our website at http://onsemi.com.
MC100EP16VT
http://onsemi.com
9
PACKAGE DIMENSIONS
SO–8
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–07
ISSUE W
SEATING
PLANE
1
4
58
N
J
X 45
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
–X–
–Y–
G
M
Y
M
0.25 (0.010)
–Z–
Y
M
0.25 (0.010) Z
S
X
S
M

DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 2.90 3.10 0.114 0.122
B 2.90 3.10 0.114 0.122
C 0.80 1.10 0.031 0.043
D 0.05 0.15 0.002 0.006
F 0.40 0.70 0.016 0.028
G 0.65 BSC 0.026 BSC
L 4.90 BSC 0.193 BSC
M 0 6 0 6

SEATING
PLANE
PIN 1
1
4
85
DETAIL E
B
C
D
A
G
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
8x REFK
IDENT
K 0.25 0.40 0.010 0.016
TSSOP–8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R–02
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.

MC100EP16VTDR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Bus Receivers 3.3V/5V ECL Diff
Lifecycle:
New from this manufacturer.
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