4
FN6538.2
December 2, 2008
Absolute Maximum Ratings Thermal Information
Supply Voltage, (V
CC
) . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 15V
BOOT Voltage (V
BOOT-GND
). . . . . . . . . . . . . . . .GND - 0.3V to 36V
BOOT to PHASE Voltage (V
BOOT
- V
PHASE
). . .GND - 0.3V to 15V
-0.3V to 16V (<10ns, 10µJ)
UGATE Voltage (V
UGATE
) . . . . . . .V
PHASE
- 0.3V to V
BOOT
+ 0.3V
V
PHASE
- 3.5V (<100ns Pulse Width, 2µJ) to V
BOOT
+0.3V
LGATE/OCSET Voltage (V
LGATE
). . . . . .GND - 0.3V to V
CC
+ 0.3V
GND - 5V (<100ns Pulse Width, 2µJ) to V
CC
+ 0.3V
PHASE Voltage (V
PHASE
). . . . . . . . . .GND - 0.3V to V
BOOT
+ 0.3V
GND - 8V (<400ns, 20µJ) to 30V (<200ns, V
BOOT-GND
<36V)
FB, VOS, COMP/EN Voltage. . . . . . . . . . . . . . . . .GND - 0.3V to 6V
PGOOD Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . .GND - 0.3V to 7V
Thermal Resistance (Typical) θ
JA
(°C/W) θ
JC
(°C/W)
10 Ld TDFN Package (Notes 1, 2). . . . 44 3.5
Maximum Power Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . -65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Supply Voltage Range, V
CC
. . . . . . . . . . . . . . . . . . . +4.5V to 14.4V
Ambient Temperature Range
ISL6341xCRZ (Commercial) . . . . . . . . . . . . . . . . . . 0°C to +70°C
ISL6341xIRZ (Industrial) . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Junction Temperature Range. . . . . . . . . . . . . . . . . .-40°C to +125°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air, with “direct attach” features. See
Tech Brief TB379 for details.
2. For θ
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Test Conditions: V
CC
= 12V, T
J
= 0°C to +85°C, Unless Otherwise Noted. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
V
CC
SUPPLY CURRENT
Input Bias Supply Current I
VCC_dis
V
CC
= 12V; disabled 7.0 mA
Input Bias Supply Current I
VCC_en
V
CC
= 12V; enabled (but not switching) 6.4 8.9 10.4 mA
POWER-ON RESET
Rising V
CC
POR Threshold V
POR
3.8 4.2 4.47 V
V
CC
POR Threshold Hysteresis 0.15 0.48 0.85 V
OSCILLATOR
Switching Frequency f
OSC
ISL6341C, ISL6341CC 270 300 330 kHz
ISL6341I, ISL6341CI 240 300 330 kHz
ISL6341AC, ISL6341BC 540 600 660 kHz
ISL6341AI, ISL6341BI 510 600 660 kHz
Ramp Amplitude (Note 3) ΔV
OSC
1.5 V
P-P
REFERENCE
Reference Voltage Tolerance V
REF
ISL6341C, ISL6341AC, ISL6341BC,
ISL6341CC
0.7936 0.8000 0.8064 V
ISL6341I, ISL6341AI, ISL6341BI, ISL6341CI 0.7920 0.8000 0.8080 V
ERROR AMPLIFIER
DC Gain (Note 3) GAIN 96 dB
Gain-Bandwidth Product (Note 3) GBWP 20 MHz
Slew Rate (Note 3) SR 8 V/µs
GATE DRIVERS
Upper Gate Source Impedance R
UG-SRCh
V
CC
= 12V; I = 50mA 2.1 Ω
Upper Gate Sink Impedance R
UG-SNKh
V
CC
= 12V; I = 50mA 1.6 Ω
Lower Gate Source Impedance R
LG-SRCh
V
CC
= 12V; I = 50mA 1.4 Ω
Lower Gate Sink Impedance R
LG-SNKh
V
CC
= 12V; I = 50mA 1.0 Ω
Upper Gate Source Impedance R
UG-SRCl
V
CC
= 5V; I = 50mA 2.4 Ω
ISL6341, ISL6341A, ISL6341B, ISL6341C
5
FN6538.2
December 2, 2008
Functional Pin Description
VCC (Pin 6)
This pin provides the bias supply for the ISL6341x, as well
as the lower MOSFET’s gate. An internal regulator will
supply bias as VCC rises above 5V, but the LGATE/OCSET
will still be sourced by VCC. Connect a well-decoupled 5V to
12V supply to this pin.
FB (Pin 8)
This pin is the inverting input of the internal error amplifier. Use
FB, in combination with the COMP/EN pin, to compensate the
voltage-control feedback loop of the converter. A resistor divider
from V
OUT
to FB to GND is used to set the regulation voltage.
VOS (Pin 9)
This input pin monitors the regulator output for OV and UV
protection, and PGOOD (OV and UV). Connect a resistor
divider from V
OUT
to VOS to GND, with the same ratio as
the FB resistor divider. It is not recommended to share one
divider for both FB and VOS; the response to a fault may not
be as quick or robust. There is a small pull-up bias current
on the pin; if the VOS pin is not connected, the OV protection
would be tripped to protect the load.
GND (Pin 5)
This pin represents the signal and power ground for the IC.
This pin is the high current connection, and should be tied to
the ground island/plane through the lowest impedance
connection available. The metal pad under the package
should also be connected to the GND plane for thermal
conductivity, but does not conduct any current.
PHASE (Pin 2)
Connect this pin to the source of the upper MOSFET, and
the drain of the lower MOSFET. It is used as the sink for the
UGATE driver, and to monitor the voltage drop across the
lower MOSFET for overcurrent protection. This pin is also
monitored by the adaptive shoot-through protection circuitry
to determine when the upper MOSFET has turned off.
UGATE (Pin 3)
Connect this pin to the gate of upper MOSFET; it provides
the PWM-controlled gate drive. It is also monitored by the
adaptive shoot-through protection circuitry to determine
when the upper MOSFET has turned off.
BOOT (Pin 1)
This pin provides ground referenced bias voltage to the upper
MOSFET driver. A bootstrap circuit is used to create a voltage
suitable to drive an N-Channel MOSFET (equal to V
GD
minus
the BOOT diode voltage drop), with respect to PHASE.
COMP/EN (Pin 7)
This is a multiplexed pin. During soft-start and normal converter
operation, this pin represents the output of the error amplifier.
Use COMP/EN, in combination with the FB pin, to compensate
the voltage-control feedback loop of the converter.
Upper Gate Sink Impedance R
UG-SNKl
V
CC
= 5V; I = 50mA 1.7 Ω
Lower Gate Source Impedance R
LG-SRCl
V
CC
= 5V; I = 50mA 1.5 Ω
Lower Gate Sink Impedance R
LG-SNKl
V
CC
= 5V; I = 50mA 1.1 Ω
PROTECTION/DISABLE
OCSET Current Source I
OCSET
LGATE/OCSET = 0V 9 10 11 µA
Enable Threshold (COMP/EN pin) V
ENABLE
0.683 0.700 0.717 V
VOS Rising Trip (PGOOD OV; +10%) 0.868 0.880 0.888 V
VOS Rising Trip (PGOOD OV) Hysteresis 16 mV
VOS Falling Trip (PGOOD UV; -10%) 0.708 0.720 0.732 V
VOS Falling Trip (PGOOD UV) Hysteresis 16 mV
VOS Rising Threshold (OV; +25%) 0.980 1.000 1.020 V
VOS Falling Threshold (UV; -25%)
(Note 5)
0.580 0.600 0.620 V
VOS Threshold (OV; 50% of V
OUT
) 0.380 0.400 0.410 V
VOS Bias Current VOS = 0.25V -1500 -250 -100 nA
PGOOD I
PGOOD
= 4mA 0.10 0.18 0.30 V
NOTES:
3. Limits should be considered typical and are not production tested.
4. Limits established by characterization and are not production tested.
5. The UVP is disabled on the ISL6341C; no trip point is measured.
Electrical Specifications Test Conditions: V
CC
= 12V, T
J
= 0°C to +85°C, Unless Otherwise Noted. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested. (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
ISL6341, ISL6341A, ISL6341B, ISL6341C
6
FN6538.2
December 2, 2008
Pulling COMP/EN low (V
ENABLE
= 0.7V nominal) will
disable the controller, which causes the oscillator to stop, the
LGATE and UGATE outputs to be held low, and the soft-start
circuitry to re-arm. The external pull-down device will initially
need to overcome up to 5mA of COMP/EN output current.
However, once the IC is disabled, the COMP output will also
be disabled, so only a 20µA current source will continue to
draw current.
When the pull-down device is released, the COMP/EN pin will
start to rise, at a rate determined by the 20µA charging up the
capacitance on the COMP/EN pin. When the COMP/EN pin
rises above the V
ENABLE
trip point, the ISL6341x will begin a
new initialization and soft-start cycle.
LGATE/OCSET (Pin 4)
Connect this pin to the gate of the lower MOSFET; it provides
the PWM-controlled gate drive (from V
CC
). This pin is also
monitored by the adaptive shoot-through protection circuitry to
determine when the lower MOSFET has turned off.
During a short period of time following Power-On Reset
(POR) or shut-down release, this pin is also used to
determine the overcurrent threshold of the converter.
Connect a resistor (R
OCSET
) from this pin to GND. See
“Overcurrent Protection (OCP)” on page 8 for equations. See
Table 1 for summary of overcurrent responses. Some of the
text describing the LGATE function may leave off the
OCSET part of the name when it is not relevant to the
discussion.
PGOOD (Pin 10)
This output is an open-drain pull-down device that reflects
the state of the PGOOD comparators. An external pull-up
resistor should be connected to a supply 6V. The output will
be held low through the soft-start ramp, and is allowed to go
high at the end of soft-start, if the VOS voltage is within its
window. The PGOOD window is tighter than the OV or UV
protection window, to give an early warning of a problem.
The PGOOD does respond directly to an OCP condition, but
may also go low if V
OUT
drops low enough before an OCP
trip.
Figure 1 shows a simplified timing diagram. The
Power-On-Reset (POR) function continually monitors the
bias voltage at the VCC pin. Once the rising POR threshold
is exceeded (V
POR
= 4.3V nominal), the POR function
initiates the Overcurrent Protection (OCP) sample and hold
operation (while COMP/EN is ~1V). When the sampling is
complete, V
OUT
begins the soft-start ramp.
Functional Description
Initialization (POR and OCP Sampling)
If the COMP/EN pin is held low during power-up, that will just
delay the initialization until it is released and the COMP/EN
voltage is above the V
ENABLE
trip point.
Figure 2 shows a typical power-up sequence in more detail.
The initialization starts at t0, when either V
CC
rises above
V
POR
, or the COMP/EN pin is released (after POR). The
COMP/EN will be pulled up by an internal 20µA current
source, but the timing will not begin until the COMP/EN
exceeds the V
ENABLE
trip point (at t1). The external
capacitance of the disabling device, as well as the
compensation capacitors, will determine how quickly the
20µA current source will charge the COMP/EN pin. With
typical values, it should add a small delay compared to the
soft-start times. The COMP/EN will continue to ramp to ~1V.
TABLE 1. SUMMARY OF FEATURE DIFFERENCES
PART
NUMBER
f
SW
(kHz)
MAX
DUTY
CYCLE
(%)
OCP
(OVERCURRENT PROTECTION)
ISL6341 300 85 Latch off; toggle POR or COMP/EN
to restart
ISL6341A 600 75 “Hiccup” mode (infinite retries)
ISL6341B 600 75 Latch off; toggle POR or COMP/EN
to restart
ISL6341C 300 85 “Hiccup” mode (infinite retries); UVP
is disabled
FIGURE 1. POR AND SOFT-START OPERATION
GND>
COMP/EN (1V/DIV)
V
OUT
(1V/DIV)
V
CC
(2V/DIV)
~4.3V POR
GND>
GND>
GND>
ISL6341, ISL6341A, ISL6341B, ISL6341C

ISL6341ACRZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers 10LD 3X3 SYNC PWM BUCK CNTRLR 5V OR
Lifecycle:
New from this manufacturer.
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