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Derating
Derating (thermal resistance): 0.666W/°K (1.5K/W). Without a heatsink, when in free air at
25°C, the TEH100 is rated for 3.5W. Derating for temp. above 25°C is 0.0234W/°K.
Graphed value is only valid when using a thermal conduction to the heatsink Rth-
cs<0.025°K/W. This value can be reached by using thermal transfer compound with a
heat conductivity of 1W/mK. The flatness of the cooling plate must be better than 0.05mm
overall. The roughness of the surface should not exceed 6.4µm. The case temperature is
to be used for the definitiion of the applied power limit. The case temperature measurement
must be made with a thermocouple contacting the center of the component mounted on the
designed heat sink. Thermal grease should be applied properly
TEH100 Series
100 Watt Thick Film Power Resistors for High
Frequency and Pulse Loading Applications
Resistor
thick film on alumina
Case
high temperature plastic
Lead Material
Tinned Copper
Installation, max.
Torque
0.9 Nm using an M3 screw and a
compression washer
Derating
linear, 100% at 25°C to 0% at
175°C
Resistance range
0.05Ω to 1MΩ, other values on
request
Resistance tol.
±1%, ±2%, ±5%, ±10%
Max. working voltage
350V
Temperature
Coefficient
>10Ω: 50ppm/°C, ref. to 25°C
3 to 10Ω: 100ppm/°C
1 to 2.99Ω: 250ppm/°C
<1Ω: 500-1000+ppm/°C (Contact
factory for exact values below
1Ω)
Insulation Resistance
10GΩ min.
Dielectric Strength
1,800 VAC
Test Conditions Of Test Performance
Load life
MIL-R-39009D 4.8.13 , 2,000
hours at rated power
∆R ≤ ±(1.0% + 0.0005Ω)
Moisture resis-
tance
-10°C - +65°C, RH>90%, cycle
240 h
∆R ≤ ±(0.50% + 0.0005Ω)
Short time
overload
1.5 times rated power and
V(DC) ≤1.5Vmax for 5 seconds
∆R ≤ ± (0.50% + 0.0005Ω)
Thermal shock
GJB360A-96 method 107,
Cond. F
∆R ≤ ±(0.50% + 0.0005Ω)
Dielectric
strength
GJB360A-96 method 301,
(1,800V AC, 60s)
∆R ≤ ± (0.15% + 0.0005Ω)
Terminal
strength
GJB360A-96 method 211,
Cond. A (Pull Test) 2.4N
∆R ≤ ±(0.20% + 0.0005Ω)
High frequency
vibration
GJB360A-96 method 204,
Cond. D
∆R ≤ ±(0.40% + 0.0005Ω)
100
Percent Rated Power
Bottom of base plate Temperature, °C
60
20
0
0
80
40
75 100 1751255025 150
THIS PRODUCT IS DESIGNED FOR
USE WITH PROPER HEATSINKING.
Maximum base plate temperature of the resistor must be
monitored and kept within specified limits to establish
the power rating. Best technique is to attach a ther-
mocouple to the side of the base plate of the resistor.
Temperature of plastic housing or heat sink cannot be
used to establish rating of the resistor.
Ohmite offers the totally
encapsulated and insulated
TO-247 package for low
ohmic value and non-induc-
tive design for high-frequen-
cy and pulsing applications.
Ideal use is for power sup-
plies. This series is rated
at 100 Watts mounted to a
heat sink.
FEATURES
• 100 Watt power rating at
25°C case temperature
• Non-inductive performance
• Low thermal resistance
• RoHS compliant design
• TO-247 package configura-
tion
• Single screw mounting
simplifies attach-ment to
the heat sink
• A totally molded housing
for enviromental protection
• Non-Inductive design
• Resistor package totally
insulated from heat sink
CHARACTERISTICS
(continued)
