Characteristics TN1215, TYN612, TYN812, TYN1012
4/17 DocID7475 Rev 11
Figure 1. Maximum average power dissipation
versus average on-state current
Figure 2. Average and DC on-state current
versus case temperature
3:
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Figure 3. Average and DC on-state current
versus ambient temperature (DPAK, D
2
PAK)
Figure 4. Relative variation of thermal
impedance junction to case versus pulse
duration
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1E-3 1E-2 1E-1 1E+0
0.1
0.2
0.5
1.0
K=[Z /R
th(j-c) th(j-c)
]
t (s)
p
Figure 5. Relative variation of thermal
impedance junction to ambient versus pulse
duration
Figure 6. Relative variation of gate trigger,
latching and holding current versus junction
temperature
1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
0.01
0.10
1.00
K=[Z /R
th(j-a) th(j-a)
]
t (s)
p
DPAK
TO-220AB / IPAK
DPAK
2
Device mounted on FR4 with
recommended pad layout
, ,,>7@
*7 + / M
, , , >7 &@
*7 + / M
7 &
M
,
*7
,
+
,
/
