7WBD3126
http://onsemi.com
8
PACKAGE DIMENSIONS
UDFN8 1.8 x 1.2, 0.4P
CASE 517AJ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
E
D
BOTTOM VIEW
b
e
8X
BAC
C
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10
C
A
A1
(A3)
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L
8X
1
4
58
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.80 BSC
E 1.20 BSC
e 0.40 BSC
L 0.45 0.55
e/2
b2 0.30 REF
L1 0.00 0.03
L2 0.40 REF
DETAIL A
(L2)
(b2)
NOTE 5
L1
DETAIL A
M
0.10
M
0.05
0.22
0.32
8X
1.50
0.40 PITCH
0.66
DIMENSIONS: MILLIMETERS
MOUNTING FOOTPRINT*
7X
1
SOLDERMASK DEFINED
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
