ADG1401/ADG1402
Rev. 0 | Page 7 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 5.
Parameter Rating
V
DD
to V
SS
35 V
V
DD
to GND −0.3 V to +25 V
V
SS
to GND +0.3 V to −25 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Digital Inputs
1
GND − 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D
(Pulsed at 1 ms, 10%
Duty-Cycle Maximum)
8-Lead MSOP (4-Layer Board) 500 mA
8-Lead LFCSP 700 mA
Continuous Current per
Channel, S or D
Data in Table 4 + 15%
Operating Temperature Range
Industrial −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Reflow Soldering Peak
Temperature, Pb Free
260°C
1
Over voltages at IN, S, or D are clamped by internal diodes. Current should
be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
8-Lead MSOP (4-Layer Board) 206 44 °C/W
8-Lead LFCSP 50.8 °C/W
ESD CAUTION
