Reference Spec.No.JENF243A-0018AH-01 P8/11
MURATA MFG.CO.,LTD.
Reference Only
< For BLM15P
□
,
BLM15AX, BLM15KD type >
Rated
Current
(A)
ab c
Land pad thickness
and dimension d
18µm 35µm 70µm
1.5 Max
0.4
1.2 to 1.4
0.5
0.5 0.5 0.5
2.2 Max 1.2 0.7 0.5
3.0 Max 2.4 1.2 0.5
(in mm)
∗The excessive heat by land pads may cause
deterioration at joint of products with substrate.
10-2.Soldering Conditions
Products can be applied to reflow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3) Soldering profile
Standard Profile Limit Profile
Pre-heating 150～180°C 、90s±30s
Heating above 220°C、30s～60s above 230°C、60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
10-3. Reworking with soldering iron
• Pre-heating: 150°C, 1 min • Soldering iron output: 80W max.
• Tip temperature: 350°C max. • Tip diameter:φ3mm max.
• Soldering time : 3(+1,-0) seconds. • Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
ｄ
Chip Ferrite Bead
Solder Resist
Pattern
ｃ
ａ
ｂ
