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BLM15PX471SN1D

P1-P3P4-P6P7-P9P10-P11
Reference Spec.No.JENF243A-0018AH-01 P4/11
MURATA MFG.CO.,LTD.
Reference Onl
y
4.Style and Dimensions
■ Equivalent Circuit
■ Unit Mass(Typical value)
0.001g
5.Marking
No marking.
6.Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
7-2.Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance
And
Dimensions
Meet item 4. Visual Inspection and measured with Slide Calipers.
7-2-2 Bonding
Strength
Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force(F) : 5N
Applying Time : 5s±1s
Applying Direction: Parallel to the substrate.
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×0.8mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
:Electrode
1.0±0.05
0.5±0.05
0.25±0.1
0.5±0.05
(in mm)
Resistance element becomes
dominant at high frequencies.
()
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC
Resistance
Meet item 3.
R0.5
Ｆ
Substrate
Ｆ
Side view
45mm
R340
F
Deflection
45mm
Product
Pressure jig
Reference Spec.No.JENF243A-0018AH-01 P5/11
MURATA MFG.CO.,LTD.
Reference Only
No. Item Specification Test Method
7-2-4 Vibration Meet Table 1. It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
7-2-5 Resistance
to Soldering
Heat
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room conditionfor 48h±4h.
7-2-6 Drop Products shall be no failure
after tested.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction(Total 9 times)
7ｰ2-7 Solderability The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
7-3.Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle
Meet Table 1. 1 cycle :
1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125 °C(+3 °C,-0 °C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for
48h±4h.
7-3-2 Humidity Temperature : 40°C±2°C
Humidity : 90%RH to 95%RH
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for
48h±4h.
7-3-3 Heat Life Meet Table 2.
Table 2
Temperature : 125°C±3°C
Applying Current : Rated Current(at 125°C)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for
48h±4h.
7-3-4 Cold
Resistance
Meet Table 1. Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for
48h±4h.
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
(for BLM15PD
Within ±40%)
DC
Resistance
Meet item 3.
Reference Spec.No.JENF243A-0018AH-01 P6/11
MURATA MFG.CO.,LTD.
Reference Only
8.Specification of Packaging
8-1.Appearance and Dimensions
(8mm-wide paper tape)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
8-2.Tape Strength
(1)Pull Strength
Top tape
5N min.
Bottom tape
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel 10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2) , Quantity, etc)
∗1) « Expression of Inspection No. » □□
OOOO ×××
(1) (2) (3)
(1)
Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking » ROHS – Y (△)
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is sticked on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking(∗2) ,Quantity, etc)
F
165 to 180 degree
Top tape
Bottom tape
Base tape
0.8max.
0.65(Typ.)
1.15(Typ.)
(in mm)
2.0±0.05
2.0±0.05
4.0±0.1
φ
1.5
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.3
Direction of Feed
P1-P3P4-P6P7-P9P10-P11

BLM15PX471SN1D

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Description:
EMI Filter Beads, Chips & Arrays 0402 470ohm 1000mA +/-25%
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