NCP4894
http://onsemi.com
5
MAXIMUM RATINGS (Note 2)
Rating Symbol Value Unit
Supply Voltage VP 6.0 V
Operating Supply Voltage Op VP 2.2 to 5.5 V −
Input Voltage V
in
−0.3 to Vcc +0.3 V
Max Output Current Iout 500 mA
Power Dissipation (Note 3) Pd Internally Limited −
Operating Ambient Temperature T
A
−40 to +85 °C
Max Junction Temperature T
J
150 °C
Storage Temperature Range T
stg
−65 to +150 °C
Thermal Resistance Junction−to−Air Micro−10
DFN 3x3 mm
9−Pin Flip−Chip
R
q
JA
200
70
(Note 4)
°C/W
ESD Protection Human Body Model (HBM) (Note 5)
Machine Model (MM) (Note 6)
− > 2000
> 200
V
Latchup Current at T
A
= 85°C (Note 7) − 100 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
A
= +25°C.
3. The thermal shutdown set to 160°C (typical) avoids irreversible damage on the device due to power dissipation. For further information see
page 7.
4. For the 9−Pin Flip−Chip CSP package, the R
q
JA
is highly dependent of the PCB Heatsink area. For example, R
q
JA
can equal 195°C/W with
50 mm
2
total area and also 135°C/W with 500 mm
2
. For further information see page 10. The bumps have the same thermal resistance and
all need to be connected to optimize the power dissipation.
5. Human Body Model, 100 pF discharge through a 1.5 kW resistor following specification JESD22/A114.
6. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
7. Maximum ratings per JEDEC standard JESD78.
