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MPXV4006GC6T1

P1-P3P4-P6P7-P9P10-P11
MPXV4006G
Sensors
4 Freescale Semiconductor
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The pressure sensor is
designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. SOP Footprint (Case 482)
Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table
Part Number Case Type Pressure (P1) Side Identifier
MPXV4006G6U/T1 482 Stainless Steel Cap
MPXV4006GC6U/T1 482A Side with Port Attached
MPXV4006G7U 482B Stainless Steel Cap
MPXV4006GC7U 482C Side with Port Attached
MPXV4006GP 1369 Side with Port Attached
MPXV4006DP 1351 Side with Part Marking
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP
2.54
0.300
7.62
inch
mm
PACKAGE DIMENSIONS
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010) A
S
T
-A-
-B-
N
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 5.380.2300.212 5.84
D 0.960.0420.038 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
M 0˚ 7˚ 0˚ 7˚
N 0.405 0.415 10.29 10.54
S 0.709 0.725 18.01 18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
SURFACE MOUNT
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
W
C
M
J
K
V
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 12.700.5200.500 13.21
D 0.960.0420.038 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
M 0˚ 7˚ 0˚ 7˚
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
V 0.245 0.255 6.22 6.48
W 0.115 0.125 2.92 3.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010) AT
-A-
-B-
N
S
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV4006G
Sensors
Freescale Semiconductor 5
PACKAGE DIMENSIONS
MILLIMETERSINCHES
0.100 BSC 2.54 BSC
DIM
A
B
C
D
G
J
K
M
N
S
MIN
0.415
0.415
0.210
0.026
0.009
0.100
0˚
0.405
0.540
MAX
0.425
0.425
0.220
0.034
0.011
0.120
15˚
0.415
0.560
MIN
10.54
10.54
5.33
0.66
0.23
2.54
0˚
10.29
13.72
MAX
10.79
10.79
5.59
0.864
0.28
3.05
15˚
10.54
14.22
PIN 1 IDENTIFIER
K
SEATING
PLANE
-T-
DETAIL X
S
G
4
5
8
1
-A-
-B-
C
M
J
N
D 8 PL
S
B
M
0.25 (0.010) A
S
T
DETAIL X
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 (0.006).
ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
THROUGH-HOLE
MILLIMETERSINCHES
0.100 BSC 2.54 BSC
DIM
A
B
C
D
G
J
K
M
N
S
V
W
MIN
0.415
0.415
0.500
0.026
0.009
0.100
0˚
0.444
0.540
0.245
0.115
MAX
0.425
0.425
0.520
0.034
0.011
0.120
15˚
0.448
0.560
0.255
0.125
MIN
10.54
10.54
12.70
0.66
0.23
2.54
0˚
11.28
13.72
6.22
2.92
MAX
10.79
10.79
13.21
0.864
0.28
3.05
15˚
11.38
14.22
6.48
3.17
PIN 1
IDENTIFIER
K
SEATING
PLANE
-T-
W
DETAIL X
S
G
4
5
8
1
-A-
-B-
N
C
V
M
J
D 8 PL
S
B
M
0.25 (0.010) A
S
T
DETAIL X
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 (0.006).
ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
THROUGH-HOLE
MPXV4006G
Sensors
6 Freescale Semiconductor
P1-P3P4-P6P7-P9P10-P11

MPXV4006GC6T1

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Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors IPS SOP
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