NCV7430
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4
Table 2. PIN FUNCTION DESCRIPTION (14 LEAD SON Package)
Pin #
Label Pin Description
1 ANODE Anode input for LED fault detection
2 VBIAS Bias output for ballast transistor
3 VBB VBB (14 V) Supply Voltage
4 LIN LIN−bus connection
5 GND Supply GND
6 TST2 Test pin (ground pin)
7 GND Supply GND
8 LED3R Current program resistor to ground for LED3C
9 LED1R Current program resistor to ground for LED1C
10 LED2R Current program resistor to ground for LED2C
11 TST1 Test pin (float pin) (Note 1)
12 LED2C Channel 2 regulated current output to LED cathode
13 LED1C Channel 1 regulated current output to LED cathode
14 LED3C Channel 3 regulated current output to LED cathode
1. Floating pin 11 eliminates the possibility of a short to ground of the adjacent pin (LED2C).
Table 3. MAXIMUM RATINGS
Parameter Min Max Unit
V
BB
Supply voltage −0.3 +43 (Note 2) V
Supply voltage −0.3 28 (Note 3) V
Vlin Bus input voltage (LIN) −45 +45 V
VVBIAS Ballast Transistor Drive Voltage Pin (VBIAS) −0.3 VANODE V
IBIAS Ballast Output Drive (VBIAS) − 10 mA
VANODE LED Fault Sense Pin (ANODE) voltage −0.3 VBB V
VLEDC LED Current Pin (LEDxC) voltage (Note 7) −0.3 VBB V
VLEDR Program Current Pin (LEDxR) voltage (Note 4) −0.3 3.6 V
T
J
Junction temperature range (Note 5) −50 +175 °C
Tflw Peak Reflow Soldering Temperature: Pb−Free
60 to 150 seconds at 217°C (Note 6)
− 260 peak
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. For limited time: t < 0.5 s.
3. t < 3 minutes
4. VLEDR cannot exceed VLEDC.
5. The circuit functionality is not fully guaranteed outside operating temperature range.
6. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D,
and Application Note AND8003/D.
7. Capacitive loading on LEDxC pins is limited to < 200 pF for proper functionality.
Table 4. ATTRIBUTES
Characteristics Value
ESD Capability Human Body Model (LIN Pin)
(Note 8) Human Body Model (All Remaining Pins)
Machine Model
> ± 4 kV
> ± 2 kV
> ± 200 V
Moisture Sensitivity Level (Note 6) MSL 2
Storage Temperature −55°C to 150°C
Package Thermal Resistance
Junction−to−Ambient (R
q
JA
) (2S2P) (Note 9)
Junction−to−Pin (R
y
JL
) (Pins 4 & 11)
100°K/W
53°K/W
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
8. HBM according to AEC−Q100: EIA−JESD22−A114−B (100 pF via 1.5 kW) and MM according to AEC−Q100: EIA−JESD22−A115−A.
9. Simulated conform JEDEC JESD51
