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DS8024-RJX+

P1-P3P4-P6P7-P9P10-P12P13-P15
DS8024
Smart Card Interface
19-6220; Rev 3; 7/12
1
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
General Description
The DS8024 smart card interface IC is a low-cost, analog
front-end for a smart card reader, designed for all ISO
7816, EMV
®
, and GSM11-11 applications. The DS8024
is a pin-for-pin drop-in replacement for the NXP
TDA8024 and is offered in 28-pin TSSOP and SO pack-
ages.
Applications requiring support for 1.8V smart cards or
requiring low power should consider the DS8113, which
achieves lower active- and stop-mode power with mini-
mal changes to application hardware and software.
Applications
Set-Top Box Conditional Access
Access Control
Banking Applications
POS Terminals
Debit/Credit Payment Terminals
PIN Pads
Automated Teller Machines
Telecommunications
Pay/Premium Television
Features
♦ Analog Interface and Level Shifting for IC Card
Communication
♦ ±8kV (min) ESD (IEC) Protection on Card
Interfaces
♦ Internal IC Card Supply-Voltage Generation:
5.0V ±5%, 80mA (max)
3.0V ±8%, 65mA (max)
♦ Automatic Card Activation and Deactivation
Controlled by Dedicated Internal Sequencer
♦ I/O Lines from Host Directly Level Shifted for
Smart Card Communication
♦ Flexible Card Clock Generation, Supporting
External Crystal Frequency Divided by 1, 2, 4, or 8
♦ High-Current, Short-Circuit and High-Temperature
Protection
Ordering Information
Note: Contact the factory for availability of other variants and
package options.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
/V denotes an automotive-qualified part.
EMV is a registered trademark of EMVCo LLC. EMV Level 1 library and hardware reference design available. Contact factory for
details.
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be
simultaneously available through various sales channels. For information about device errata, go to: www.maxim-ic.com/errata
.
PART TEMP RANGE PIN-PACKAGE
DS8024-RJX+ -40°C to +85°C 28 TSSOP
DS8024-RJX/V+ -40°C to +85°C 28 TSSOP
DS8024-RRX+ -40°C to +85°C 28 SO
Selector Guide appears at end of data sheet.
PGND
28
27
26
25
24
23
22
AUX2IN
AUX1IN
I/OIN
XTAL2
TOP VIEW
DS8024
XTAL1
OFF
GND
21 V
DD
20 RSTIN
19 CMDVCC
18 N.C.
17 V
CC
16 RST
15 CLK
5V/3V
CLKDIV2
CLKDIV1
CP1
V
DDA
V
UP
PRES
PRES
I/O
AUX2
AUX1
4
1
2
3
5
6
7
8
9
10
11
12
13
14CGND
CP2
SO/TSSOP
Pin Configuration
DS8024
Smart Card Interface
2
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED DC OPERATING CONDITIONS
(V
DD
= +3.3V, V
DDA
= +5.0V, T
A
= +25°C, unless otherwise noted.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on V
DD
Relative to GND ...............-0.5V to +6.5V
Voltage Range on V
DDA
Relative to PGND ...........-0.5V to +6.5V
Voltage Range on CP1, CP2, and V
UP
Relative to PGND...............................................-0.5V to +7.5V
Voltage Range on All Other Pins
Relative to GND......................................-0.5V to (V
DD
+ 0.5V)
Maximum Junction Temperature .....................................+125°C
Continuous Power Dissipation (multilayer board, T
A
= +70°C)
TSSOP (derate 14mW/°C above +70°C) .................1117.3mW
SO (derate 16.7mW/°C above +70°C).....................1355.9mW
Storage Temperature Range .............................-55°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Digital Supply Voltage V
DD
2.7 6.0 V
V
CC
= 5V, |I
CC
| < 80mA 4.0 6.0
Card Voltage-Generator Supply Voltage V
DDA
V
CC
= 5V, |I
CC
| < 30mA 3.0 6.0
V
V
TH2
Threshold voltage (falling) 2.30 2.45 2.60 V
Reset Voltage Thresholds
V
HYS2
Hysteresis 50 100 150 mV
CURRENT CONSUMPTION
Active V
DD
Current 5V Cards
(Including 80mA Draw from 5V Card)
I
DD_50V
I
CC
= 80mA, f
XTAL
= 20MHz,
f
CLK
= 10MHz, V
DDA
= 5.0V
215 mA
Active V
DD
Current 5V Cards
(Current Consumed by DS8024 Only)
I
DD_IC
I
CC
= 80mA, f
XTAL
= 20MHz,
f
CLK
= 10MHz, V
DDA
= 5.0V (Note 2)
135 mA
Active V
DD
Current 3V Cards
(Including 65mA Draw from 3V Card)
I
DD_30V
I
CC
= 65mA, f
XTAL
= 20MHz,
f
CLK
= 10MHz, V
DDA
= 5.0V
100 mA
Active V
DD
Current 3V Cards
(Current Consumed by DS8024 Only)
I
DD_IC
I
CC
= 65mA, f
XTAL
= 20MHz,
f
CLK
= 10MHz, V
DDA
= 5.0V (Note 2)
35 mA
Inactive-Mode Current I
DD
Card inactive 500 μA
CLOCK SOURCE
Crystal Frequency f
XTAL
External crystal 0 20 MHz
f
XTAL1
0 20 MHz
V
IL_XTAL1
Low-level input on XTAL1 (Note 3) -0.3
0.3 x
V
DD
XTAL1 Operating Conditions
V
IH_XTAL1
High-level input on XTAL1 (Note 3)
0.7 x
V
DD
V
DD
+
0.3
V
External Capacitance for Crystal
C
XTAL1
,
C
XTAL2
(Note 3) 15 pF
Internal Oscillator f
INT
2.7 MHz
SHUTDOWN TEMPERATURE
Shutdown Temperature T
SD
(Note 3) +150 °C
DS8024
Smart Card Interface
3
RECOMMENDED DC OPERATING CONDITIONS (continued)
(V
DD
= +3.3V, V
DDA
= +5.0V, T
A
= +25°C, unless otherwise noted.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RST PIN
Output Low Voltage V
OL_RST1
I
OL_RST
= 1mA 0 0.3 V
Card-Inactive Mode
Output Current I
OL_RST1
V
O_LRST
= 0V 0 -1 mA
Output Low Voltage V
OL_RST2
I
OL_RST
= 200μA 0 0.3 V
Output High
Voltage
V
OH_RST2
I
OH_RST
= -200μA
V
CC
-
0.5
V
CC
V
Rise Time t
R_RST
C
L
= 30pF (Note 3) 0.1 μs
Fall Time t
F_RST
C
L
= 30pF (Note 3) 0.1 μs
Shutdown Current
Threshold
I
RST(SD)
-20 mA
Current Limitation I
RST(LIMIT)
-20 +20 mA
Card-Active Mode
RSTIN to RST Delay t
D(RSTIN-RST)
2 μs
CLK PIN
Output Low Voltage V
OL_CLK1
I
OLCLK
= 1mA 0 0.3 V
Card-Inactive Mode
Output Current I
OL_CLK1
V
OLCLK
= 0V 0 -1 mA
Output Low Voltage V
OL_CLK2
I
OLCLK
= 200μA 0 0.3 V
Output High
Voltage
V
OH_CLK2
I
OHCLK
= -200μA
V
CC
-
0.5
V
CC
V
Rise Time t
R_CLK
C
L
= 30pF (Note 3) 8 ns
Fall Time t
F_CLK
C
L
= 30pF (Note 3) 8 ns
Current Limitation I
CLK(LIMIT)
-70 +70 mA
Clock Frequency f
CLK
Operational (Note 3) 0 10 MHz
Duty Factor C
L
= 30pF (Note 3) 45 55 %
Card-Active Mode
Slew Rate SR C
L
= 30pF (Note 3) 0.2 V/ns
V
CC
PIN
Output Low Voltage V
CC1
I
CC
= 1mA 0 0.3 V
Card-Inactive Mode
Output Current I
CC1
V
CC
= 0V 0 -1 mA
I
CC(5V)
< 80mA 4.75 5.00 5.25
I
CC(3V)
< 65mA 2.78 3.00 3.22
5V card: current pulses of 40nC
with I < 200mA, t < 400ns,
f < 20MHz (Note 3)
4.6 5.4
Output Low Voltage V
CC2
3V card: current pulses of 24nC
with I < 200mA, t < 400ns,
f < 20MHz (Note 3)
2.75 3.25
V
V
CC(5V)
= 0 to 5V -80
Output Current I
CC2
V
CC(3V)
= 0 to 3V -65
mA
Shutdown Current
Threshold
I
CC(SD)
120 mA
Card-Active Mode
Slew Rate V
CCSR
Up/down, C < 300nF 0.05 0.16 0.22 V/μs
P1-P3P4-P6P7-P9P10-P12P13-P15

DS8024-RJX+

Mfr. #:
Buy DS8024-RJX+
Manufacturer:
Maxim Integrated
Description:
Interface - Specialized Smart Card Interface
Lifecycle:
New from this manufacturer.
Delivery:
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