MAY 2015 ■ 55
ELECTRICAL SPECIFICATIONS
HOW TO ORDER
ST10
AVX
Style
5
Voltage
25V = 3
50V = 5
100V = 1
C
Temperature
Coefficient
X7R = C
186
Capacitance Code
(2 significant digits
+ no. of zeros)
1 μF = 105
10 μF = 106
M
Capacitance
Tolerance
M = ±20%
A
Test Level
A = Standard
K
Termination
N = Straight Lead
K = Leads formed in
M = Leads formed out
02
Number
of Leads
Per Side
02 = 2
CAPACITANCE (μF)
Temperature Coefficient
±15%, -55° to +125°C
Capacitance Test (MIL-STD-202, Method 305)
25°C, 1.0±0.2 Vrms (open circuit voltage) at 1KHz
Dissipation Factor
5% Max @ 25°C, for 50VDC and 100VDC voltage ratings
Insulation Resistance 25°C (MIL-STD-202, Method 302)
500 MΩ-μF (*100 MΩ-μF)
Insulation Resistance 125°C (MIL-STD-202, Method 302)
50 MΩ-μF (*10 MΩ-μF)
Dielectric Withstanding Voltage 25°C (Flash Test)
250% rated voltage for 5 seconds with 50 mA max charging current.
Life Test Capabilities (1000 hrs)
150% rated voltage at +125°C.
Mini-TurboCap
TM
Small Footprint, High Volumetric Efficiency,
High-CV SMPS Capacitors
Voltage
Cap (μF) 25V 50V 100V
8.2
18
39*
82*
The Mini-TurboCap is constructed from state-of-the-art BME
(Base Metal Electrode) MLC Capacitors achieving very high
CV, as well as, ultra low ESR and ESL. The resulting, very
large capacitance values allow for component and board
space reduction. Stress relieving lead frames provide effective
mechanical decoupling of the ceramic chips from the board,
minimizing the stress created by board flexing, vibration and
temperature cycling. High temperature solder is used to
attach chips to the lead frame thus eliminating the risk of
solder reflow during assembly to the board.
Not RoHS Compliant
Additional stacked/lead configurations available upon request. Consult with AVX factory personnel for details.
