ADV3221/ADV3222
Rev. 0 | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION
Table 4.
Parameter Rating
Supply Voltage (V+ − V−) 12 V
Analog Input Voltage V− to V+
Digital Input Voltage 0 V to V+
Output Voltage (Disabled Output) (V+ − 1 V) to (V− + 1 V)
Output Short-Circuit Duration Momentary
Output Short-Circuit Current 50 mA
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 150°C
The ADV3221/ADV3222 are operated with ±5 V supplies and
can drive loads down to 150 , resulting in a wide range of
possible power dissipations. For this reason, extra care must
be taken to adjust the operating conditions based on ambient
temperature.
Packaged in a 16-lead narrow-body SOIC, the ADV3221 and
ADV3222 junction-to-ambient thermal impedance (θ
JA
) is 81°C/W.
For long-term reliability, the maximum allowed junction tempera-
ture of the die, T
J
, should not exceed 125°C. Temporarily exceeding
this limit may cause a shift in parametric performance due to a
change in stresses exerted on the die by the package. Figure 4
shows the range of the allowed internal die power dissipations
that meet these conditions over the −40°C to +85°C ambient
temperature range. When using Figure 4, do not include the
external load power in the maximum power calculation, but
do include the load current through the die output transistors.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.50
1.25
1.00
0.75
0.50
15 25 35 45 55 65 75 85
MAXIMUM POWER (W)
AMBIENT TEMPERATURE (°C)
T
J
= 125°C
08652-004
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
16-Lead Narrow-Body SOIC 81 43 °C/W
Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature
ESD CAUTION
