BAP70AM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 7 March 2014 2 of 8
NXP Semiconductors
BAP70AM
Silicon PIN diode array
4. Marking
5. Limiting values
6. Thermal characteristics
Table 3. Marking
Type number Marking code Description
BAP70AM N9* * = - : made in Hong Kong
* = p : made in Hong Kong
* = t : made in Malaysia
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
R
reverse voltage - 50 V
I
F
forward current - 100 mA
P
tot
total power dissipation T
sp
=90C- 300mW
T
stg
storage temperature 65 +150 C
T
j
junction temperature 65 +150 C
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-sp)
thermal resistance from junction
to solder point
260 K/W