II. Manufacturing Information
A. Description/Function: 1Gbps to 10.3Gbps Linear Equalizer
B. Process: MB3H
C. Number of Device Transistors: 515
D. Fabrication Location: Oregon
E. Assembly Location: Thailand
F. Date of Initial Production: December 22, 2008
III. Packaging Information
A. Package Type: 38-pin TQFN 5x7
B. Lead Frame: Copper
C. Lead Finish: 100% matte Tin
D. Die Attach: Conductive Epoxy
E. Bondwire: Au (1.0 mil dia.)
F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: #
H. Flammability Rating: Class UL94-V0
MAX3986UTU+
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja: 38°C/W
K. Single Layer Theta Jc: 1.4°C/W
L. Multi Layer Theta Ja: 28°C/W
M. Multi Layer Theta Jc: 1.4°C/W
IV. Die Information
A. Dimensions: 83.1 X 160.3 mils
B. Passivation: BCB
C. Interconnect: 2 x Aluminum/Cu (Cu = 0.5%), top layer 100% Cu
D. Backside Metallization: None
E. Minimum Metal Width: 0.35 um
F. Minimum Metal Spacing: 0.35 um
G. Bondpad Dimensions: 5 mil. Sq.
H. Isolation Dielectric: SiO
2
I. Die Separation Method: Saw
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