MAX1091/MAX1093
When applying an external reference to REF, disable
the internal reference buffer by connecting REFADJ to
V
DD
. The DC input resistance at REF is 25k.
Therefore, an external reference at REF must deliver up
to 200µA DC load current during a conversion and
have an output impedance less than 10. If the refer-
ence has higher output impedance or is noisy, bypass
it close to the REF pin with a 4.7µF capacitor.
Power-Down Modes
Save power by placing the converter in a low-current
shutdown state between conversions. Select standby
mode or shutdown mode using bits D6 and D7 of the
control byte (Tables 1 and 2). In both software power-
down modes, the parallel interface remains active, but
the ADC does not convert.
Standby Mode
While in standby mode, the supply current is 850µA
(typ). The part powers up on the next rising edge on
WR and is ready to perform conversions. This quick
turn-on time allows the user to realize significantly
reduced power consumption for conversion rates
below 250ksps.
Shutdown Mode
Shutdown mode turns off all chip functions that draw qui-
escent current, reducing the typical supply current to
2µA immediately after the current conversion is complet-
ed. A rising edge on WR causes the MAX1091/MAX1093
to exit shutdown mode and return to normal operation.
To achieve full 10-bit accuracy with a 4.7µF reference
bypass capacitor, 500µs is required after power-up.
Waiting 500µs in standby mode, instead of in full-power
mode, can reduce power consumption by a factor of 3 or
more. When using an external reference, only 50µs is
required after power-up. Enter standby mode by per-
forming a dummy conversion with the control byte speci-
fying standby mode.
Note: Bypassing capacitors larger than 4.7µF between
REF and GND results in longer power-up delays.
Transfer Function
Table 6 shows the full-scale voltage ranges for unipolar
and bipolar modes.
Figure 8 depicts the nominal, unipolar input/output (I/O)
transfer function and Figure 9 shows the bipolar I/O
transfer function. Code transitions occur halfway
between successive-integer LSB values. Output coding
is binary, with 1 LSB = V
REF
/ 1024.
Maximum Sampling Rate/
Achieving 300ksps
When running at the maximum clock frequency of
4.8MHz, the specified throughput of 250ksps is
achieved by completing a conversion every 19 clock
cycles: 1 write cycle, 3 acquisition cycles, 13 conver-
250ksps, +3V, 8-/4-Channel, 10-Bit ADCs
with +2.5V Reference and Parallel Interface
16 ______________________________________________________________________________________
111 . . . 111
111 . . . 110
100 . . . 010
100 . . . 001
100 . . . 000
011 . . . 111
011 . . . 110
011 . . . 101
000 . . . 001
000 . . . 000
102
INPUT VOLTAGE (LSB)
OUTPUT CODE
ZS = COM
FS = REF + COM
FS512
(COM)
1 LSB =
REF
1024
FS -
3
/2 LSB
FULL-SCALE
TRANSITION
Figure 8. Unipolar Transfer Function
011 . . . 111
011 . . . 110
000 . . . 010
000 . . . 001
000 . . . 000
111 . . . 111
111 . . . 110
111 . . . 101
100 . . . 001
100 . . . 000
- FS
COM*
INPUT VOLTAGE (LSB)
OUTPUT CODE
ZS = COM
+FS - 1 LSB
*COM V
REF
/ 2
+ COM
FS
=
REF
2
-FS = + COM
-REF
2
1 LSB =
REF
1024
Figure 9. Bipolar Transfer Function
MAX1091/MAX1093
250ksps, +3V, 8-/4-Channel, 10-Bit ADCs
with +2.5V Reference and Parallel Interface
______________________________________________________________________________________ 17
Table 6. Full-Scale and Zero-Scale for Unipolar and Bipolar Operation
UNIPOLAR MODE BIPOLAR MODE
COM COMZero ScaleZero Scale
-V
REF
/2 + COM Negative Full Scale
V
REF
+ COM V
REF
/2 + COMPositive Full ScaleFull Scale
sion cycles, and 2 read cycles. This assumes that the
results of the last conversion are read before the next
control byte is written. Throughputs up to 300ksps can
be achieved by first writing a control word to begin the
acquisition cycle of the next conversion, and then read-
ing the results of the previous conversion from the bus
(Figure 10). This technique allows a conversion to be
completed every 16 clock cycles. Note that the switch-
ing of the data bus during acquisition or conversion can
cause additional supply noise, which can make it diffi-
cult to achieve true 10-bit performance.
Layout, Grounding, and Bypassing
For best performance, use printed circuit (PC) boards.
Wire-wrap configurations are not recommended since
the layout should ensure proper separation of analog
and digital traces. Do not run analog and digital lines
parallel to each other, and don’t lay out digital signal
paths underneath the ADC package. Use separate
analog and digital PC board ground sections with only
one star point (Figure 11) connecting the two ground
systems (analog and digital). For lowest-noise opera-
tion, ensure the ground return to the star ground’s
power supply is low impedance and as short as possi-
ble. Route digital signals far away from sensitive analog
and reference inputs.
High-frequency noise in the power supply (VDD) could
influence the proper operation of the ADC’s fast com-
parator. Bypass V
DD
to the star ground with a network
of two parallel capacitors, 0.1µF and 4.7µF, located as
close as possible to the MAX1091/MAX1093s’ power-
supply pin. Minimize capacitor lead length for best sup-
ply-noise rejection; add an attenuation resistor (5) if
the power supply is extremely noisy.
Definitions
Integral Nonlinearity
Integral nonlinearity (INL) is the deviation of the values
on an actual transfer function from a straight line. This
straight line can be either a best-straight-line fit or a line
drawn between the end points of the transfer function,
once offset and gain errors have been nullified. The sta-
tic linearity parameters for the MAX1091/MAX1093 are
measured using the end-point method.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between
an actual step width and the ideal value of 1 LSB. A
DNL error specification of less than 1 LSB guarantees
no missing codes and a monotonic transfer function.
Aperture Definitions
Aperture jitter (t
AJ
) is the sample-to-sample variation in
the time between the samples. Aperture delay (t
AD
) is
the time between the rising edge of the sampling clock
and the instant when an actual sample is taken.
Signal-to-Noise Ratio
For a waveform perfectly reconstructed from digital
samples, signal-to-noise ratio (SNR) is the ratio of the
full-scale analog input (RMS value) to the RMS quanti-
zation error (residual error). The ideal, theoretical mini-
mum analog-to-digital noise is caused by quantization
error only and results directly from the ADC’s resolution
(N bits):
SNR = (6.02 x N + 1.76)dB
In reality, there are other noise sources besides quanti-
zation noise: thermal noise, reference noise, clock jitter,
etc. Therefore, SNR is computed by taking the ratio of
the RMS signal to the RMS noise which includes all
spectral components minus the fundamental, the first
five harmonics, and the DC offset.
Signal-to-Noise Plus Distortion
Signal-to-noise plus distortion (SINAD) is the ratio of the
fundamental input frequency’s RMS amplitude to the
RMS equivalent of all other ADC output signals:
SINAD (dB) = 20 x log (Signal
RMS
/ Noise
RMS
)
Effective Number of Bits
Effective number of bits (ENOB) indicates the global
accuracy of an ADC at a specific input frequency and
sampling rate. An ideal ADC’s error consists of quanti-
zation noise only. With an input range equal to the full-
scale range of the ADC, calculate the effective number
of bits as follows:
ENOB = (SINAD - 1.76) / 6.02
Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the RMS
sum of the first five harmonics of the input signal to the
fundamental itself. This is expressed as:
where V
1
is the fundamental amplitude, and V
2
through
V
5
are the amplitudes of the 2nd- through 5th-order har-
monics.
Spurious-Free Dynamic Range
Spurious-free dynamic range (SFDR) is the ratio of the
RMS amplitude of the fundamental (maximum signal
component) to the RMS value of the next-largest distor-
tion component.
THD 20 log V V V V / V
2
2
3
2
4
2
5
2
1
=× +++
MAX1091/MAX1093
250ksps, +3V, 8-/4-Channel, 10-Bit ADCs
with +2.5V Reference and Parallel Interface
18 ______________________________________________________________________________________
+3V
V
LOGIC
= +2V/+3V
GND
SUPPLIES
DGND+2V/+3VCOM
GND
4.7µF
0.1µF
V
DD
DIGITAL
CIRCUITRY
MAX1091
MAX1093
R* = 5
*OPTIONAL
Figure 11. Power-Supply and Grounding Connections
CLK
ACQUISITION
CONTROL BYTE
CONVERSION
LOW
BYTE
HIGH
BYTE
D7D0 D9D8
LOW
BYTE
HIGH
BYTE
D7D0 D9D8
ACQUISITION
SAMPLING INSTANT
123 456 78910111213141516
WR
RD
HBEN
D7D0
STATE
CONTROL
BYTE
Figure 10. Timing Diagram for Fastest Conversion
Chip Information
TRANSISTOR COUNT: 5781

MAX1091BEEI+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Analog to Digital Converters - ADC 250ksps 8Ch 10-Bit w/Internal 2.5V ref
Lifecycle:
New from this manufacturer.
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