Document Number: 31003 For technical questions, contact: thickfilmchip@vishay.com
www.vishay.com
Revision: 10-Dec-10 251
CRA12E, CRA12S
Thick Film Resistor Array
Vishay
Note
(1)
Figures are given for a single element.
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2 environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
(1)
STABILITY CLASS 1
OR BETTER
STABILITY CLASS 2
OR BETTER
Stability for product type:
10 Ω to 1 MΩ
CRA12E/CRA12S
4.5 - Resistance - ± 1 % ± 2 %, ± 5 %
4.7 - Voltage proof U = 1.4 x U
ins
; 60 s No flashover or breakdown
4.13 - Short time overload
≤ 2 x U
max.
;
Duration according to style
± (0.25 % R + 0.05 Ω)± (0.5 % R + 0.05 Ω)
4.17.2 58 (Td) Solderability
Solder bath method; Sn60Pb40;
non-activated flux;
(235 ± 5) °C; (2 ± 0.2) s
Good tinning (≥ 95 % covered)
no visible damage
Solder bath method; Sn96.5Ag3Cu0.5;
non-activated flux;
(245 ± 5) °C; (3 ± 0.3) s
Good tinning (≥ 95 % covered)
no visible damage
4.8.4.2 - Temperature coefficient (20/- 55/20) °C and (20/125/20) °C ± 100 ppm/K ± 200 ppm/K
4.32 21 (U
U3
) Shear (adhesion) 45 N No visible damage
4.33 21 (U
U1
) Substrate bending Depth 2 mm; 3 times
No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 Ω)
4.19 14 (Na) Rapid change of temperature
30 min. at - 55 °C; 30 min at 125 °C
5 cycles
1000 cycles
± (0.25 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
4.23 - Dry heat -
± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
4.23.2 2 (Ba) Damp heat, cyclic 125 °C; 16 h
4.23.3 30 (Db) Cold 55 °C; ≥ 90 % RH; 24 h; 1 cycle
4.23.4 1 (Aa) Low air pressure - 55 °C; 2 h
4.23.5 13 (M) - 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic 55 °C; ≥ 90 % RH; 24 h; 5 cycle
4.23.7 - DC load
4.25.1 - Endurance at 70 °C
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
4.18.2 58 (Td) Resistance to soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
4.35 - Flammability, needle flame test IEC 60695-11-5; 10 s No burning after 30 s
4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (1 % R + 0.05 Ω)
4.25.3 -
Endurance at
upper category temperature
155 °C; 1000 h ± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
4.40 -
Electrostatic discharge
(human body model)
IEC 61340-3-1;
3 positive and 3 negative discharges;
ESD voltage: 500 V
± (1 % R + 0.05 Ω)
4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage
4.30 45 (XA) Solvent resistance of marking
Isopropyl alcohol; 50 °C; method 1;
toothbrush
Marking legible,
no visible damage
4.22 6 (Fc)
Vibration, endurance
by sweeping
f = 10 Hz to 2000 Hz; x, y, z ≤ 1.5 mm;
A ≤ 200 m/s
2
; 10 sweeps per axis
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
4.37 - Periodic electric overload
0.1 s on; 2.5 s off; 1000 cycles
± (1 % R + 0.05 Ω)
4.27 -
Single pulse high voltage
overload, 10 µs/700 µs 10 pulses
± (1 % R + 0.05 Ω)
U 15 x P
70
x R 2 x U
max.
≤=
Û 10 x P
70
x R 2 x U
max.
≤=