MCH18
Ceramic capacitors
!Characteristics
A (CG) (C0G)
−55
°C
~
+125
°C
Class 1 (For thermal compensation)
Temperature characteristics
Item
Operating temperature
Nominal capacitance (C)
Dissipation factor (tan δ )
Insulation resistance (IR)
Withstanding voltage
Temperature characteristics
Terminal adherence
Resistance
to vibration
Appearance
Rate of capacitance change
Dissipation factor (tanδ)
Solderability
Resistance
to soldering
heat
Appearance
Rate of capacitance change
Dissipation factor (tanδ)
Insulation resistance
Withstanding voltage
Temperature
cycling
Appearance
Rate of capacitance change
Dissipation factor (tanδ)
Insulation resistance
Humidity load
test
Appearance
Rate of capacitance change
Dissipation factor (tanδ)
Insulation resistance
High-
temperature
load test
Appearance
Rate of capacitance change
Dissipation factor (tanδ)
Insulation resistance
Must be within the specified tolerance range.
100 / (400
+
20C)
%
or less
(Less than 30 pF)
0.1
%
or less (30 pF or larger)
10,000M
Ω
or 500Μ
Ω⋅µF
, whichever is smaller
The insulation must not be damaged.
Within 0
±
30ppm /
°C
No detachment or signs of detachment.
There must be no mechanical damage.
Must be within initial tolerance.
Must satisfy initial specified value.
At least 3 / 4 of the surface of the two terminals
must be covered with new solder.
There must be no mechanical damage.
±
2.5
%
or
±
0.25 pF , whichever is larger.
Must satisfy initial specified value.
10,000M
Ω
or 500Μ
Ω⋅µF
, whichever is smaller
The insulation must not be damaged.
There must be no mechanical damage.
±
2.5
%
±
0.25 pF , whichever is larger.
Must satisfy initial specified value.
10,000M
Ω
or 500Μ
Ω⋅µF
, whichever is smaller
There must be no mechanical damage.
±
7.5
%
or
±
0.75 pF , whichever is larger.
0.5
%
or less
500M
Ω
or 25Μ
Ω⋅µF
, whichever is smaller
There must be no mechanical damage.
0.3
%
or less
1,000M
Ω
or 50Μ
Ω⋅µF
, whichever is smaller
±
3.0
%
or
±
0.3 pF , whichever is larger.
Test methods / conditions
(based on JIS C 5102)
Based on paragraph 7.8 and paragraph 9
Measured at room temperature and standard humidity.
1000pF or less Measurement frequency
Measurement voltage
Over 1000pF
Measurement voltage
Measurement frequency
Based on paragraph 7.6
Measurement is made after rated voltage
is applied for 60
±
5s.
Based on paragraph 7.1
Apply 300
%
of the rated voltage
for 1 to 5s then measure.
The temperature coefficients in table 12, paragraph
7.12 are calculated at 20
°C
and high temperature.
Based on paragraph 8.11.2
Apply 5N for 10
±
1s
in the direction indicated
by the arrow.
Capacitor
Test board
Pressure (5N)
Chip is mounted to a board in the
manner shown on the right, subjected
to vibration (type A in paragraph 8.2),
and measured 24
±
2 hrs. later.
Board
Based on paragraph 8.13
Soldering time
Based on paragraph 8.14
Soldering temperature
Soldering time
Preheating
Based on paragraph 9.3
Number of cycles : 5
Capacitance measured after 24
±
2 hrs.
Based on paragraph 9.9
Relative humidity
Applied voltage
Test time
Capacitance measured after 24
±
2 hrs.
Test temperature
Applied voltage
Test time
Capacitance measured after 24
±
2 hrs.
: 1
±
0.1MHz
: 1
±
0.1Vrms.
: 1
±
0.1kHz
: 1
±
0.1Vrms.
: 235
±
5
°C
: 2
±
0.5s
Soldering temperature
: 260
±
5
°C
: 5
±
0.5s
: 150
±
10
°C
for
1 to 2 min.
Test temperature
: 40
±
2
°C
: 90% to 95%
: rated voltage
: 500 to 524 hrs.
Based on paragraph 9.10
: Max. operating temp.
: rated voltage
×
200
%
: 1,000 to 1,048 hrs.
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
